Semiconductor Package Spacer Design for EMI Shielding and Burr Prevention
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Solution Overview
Problem
Semiconductor packages are prone to electromagnetic interference as they are miniaturized, and existing shielding methods can lead to manufacturing defects such as burrs during separation from the base board.
Innovation Solution
A semiconductor package design featuring a spacer with a specific geometry on the substrate, which includes a conductive blocking film applied using a sputtering deposition or conformal coating method, ensuring the film is discontinuously formed and preventing connection between the base board and substrate, thus avoiding burr formation during separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a blocking film is formed on the surface of the semiconductor package to prevent electromagnetic interference, then electromagnetic shielding is improved, but manufacturing defects such as burrs may occur during separation from the base board
Solution Approach 1:
The blocking film is divided into multiple discontinuous segments by spacing structures (such as grooves or protrusions) instead of forming a continuous film. This segmentation prevents the film from acting as a bridge that would cause burr formation during separation, while still maintaining electromagnetic shielding effectiveness through the distributed conductive elements
Solution Approach 2:
Spacing structures (grooves or protrusions) are introduced as intermediary elements between the substrate and base board. These intermediaries create physical separation that prevents direct contact and subsequent burr formation, while still allowing the blocking film to be formed on the exposed surfaces for electromagnetic shielding
2Volume of moving object
If the semiconductor package is miniaturized to reduce size, then portability is improved, but the package becomes more susceptible to electromagnetic interference
Solution Approach 1:
A thin conductive blocking film is formed on the surface of the miniaturized package to provide electromagnetic shielding. The film serves as a protective shell that blocks electromagnetic interference while adding minimal size, allowing the package to remain compact while gaining shielding capability
Solution Approach 2:
The blocking film is segmented into discontinuous regions by spacing structures, which allows effective electromagnetic shielding to be achieved with less material and reduced overall package size compared to a continuous film approach
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields against electromagnetic interference while preventing burr formation, enhancing manufacturing reliability and efficiency by maintaining the integrity of the semiconductor package.
Implementation Method 1
forming a conductive blocking film on a surface of the sealer and a side surface of the substrate, when the substrate is seated on the base board, a lower portion of the side surface of the substrate is spaced apart from the base board
Data Source
AI summary
A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer edge of a lower surface of the substrate to space the side surface of the substrate and the lower surface of the substrate to be apart from each other.