Semiconductor Package Heat Radiation Spacer Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages face challenges in effectively dissipating heat generated from semiconductor chips, particularly as devices become downscaled and more complex, leading to potential thermal interference and reliability issues.
Innovation Solution
A semiconductor package design incorporating a heat radiation spacer with high thermal conductivity materials, such as copper or silver, strategically positioned between semiconductor chips to guide and dissipate heat, along with a molding layer and heat pathway patterns to enhance heat transfer and discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are integrated in a compact package, then device capacity and functionality are improved, but heat accumulation and thermal interference worsen
Solution Approach 1:
A heat radiation spacer is introduced as an intermediary component between the first and second semiconductor chips. This spacer serves as a thermal mediator that actively manages heat transfer, preventing direct thermal coupling between adjacent chips while maintaining their functional integration in the compact package.
Solution Approach 2:
The package structure is segmented into distinct thermal zones by positioning semiconductor chips and heat radiation spacers in specific regions. The first semiconductor chip occupies a first region, the heat radiation spacer occupies a second region, and the second semiconductor chip occupies a third region, creating spatial separation of thermal management functions.
2Temperature
If heat radiation spacer is added between semiconductor chips, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The heat radiation spacer performs multiple functions simultaneously: it acts as a thermal management component for heat dissipation, provides mechanical support and spacing between chips, and serves as a structural element in the package assembly. This multi-functionality reduces the need for separate dedicated components.
Solution Approach 2:
The heat radiation spacer combines thermal management functionality with structural support functionality into a single integrated component. Rather than adding separate heat sinks and spacers, the design merges these functions into one element that accomplishes both thermal dissipation and mechanical positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation, improving the operating reliability of semiconductor chips by reducing thermal interference and enhancing the package's ability to handle heat generated from multiple chips.
Implementation Method 1
A semiconductor package includes a first semiconductor chip on a package substrate and including a first region and a second region; a second semiconductor chip in the first region; a heat radiation spacer in the second region
Data Source
AI summary
Disclosed is a semiconductor package comprising a package substrate, a first semiconductor chip on the package substrate and including a first region and a second region, a second semiconductor chip on the first region, a heat radiation spacer on the second region, a third semiconductor chip supported by the second semiconductor chip and the heat radiation spacer, and a molding layer covering the first to third semiconductor chips and the heat radiation spacer.