Semiconductor Package Heat Slug and Spacer Thermal Management
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Solution Overview
Problem
As consumption power increases due to higher processing rates and capacitance in semiconductor packages, reliability is affected, necessitating improved thermal management and structural integrity in semiconductor packages.
Innovation Solution
A semiconductor package with a system-in-package (SIP) structure is designed, featuring a substrate, lower and upper semiconductor chips, a molding layer, heat slug, and spacers with enhanced thermal conductivity materials, including silicon or metal, to manage heat and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If higher processing rates and capacitance are used to increase performance, then processing speed and capability are improved, but power consumption increases and reliability deteriorates
Solution Approach 1:
The patent introduces spacers with enhanced thermal conductivity as a parameter change to improve heat dissipation. By changing the thermal conductivity parameter of the packaging structure through the addition of high thermal conductivity spacers, the system can maintain higher processing rates while improving reliability through better thermal management
Solution Approach 2:
The spacers act as intermediary elements between the semiconductor chips and the heat dissipation structure. These spacers with enhanced thermal conductivity serve as mediators to efficiently transfer heat away from the chips, resolving the contradiction between high power consumption and reliability by introducing a thermal management intermediary
2Temperature
If more heat dissipation structures are added to improve thermal management, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
Rather than uniformly complexifying the entire package structure, the patent applies enhanced thermal conductivity spacers at specific critical locations where heat dissipation is most needed. This local quality approach improves heat dissipation effectiveness while minimizing the overall increase in device complexity by targeting only essential areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation and operational reliability by effectively transferring heat from the semiconductor chips to the heat slug through spacers, thereby addressing the reliability issues caused by increased power consumption.
Implementation Method 1
Upper spacers are disposed between the lower semiconductor chip and the heat slug. The upper spacers are disposed on the exposed top surfaces of the lower semiconductor chip... effectively transferring heat from the semiconductor chips to the heat slug through spacers
Data Source
AI summary
A semiconductor package includes a substrate. A lower semiconductor chip is disposed above the substrate. An upper semiconductor chip is disposed on the lower semiconductor chip. A top surface of the lower semiconductor chip at an end of the lower semiconductor chip is exposed. A heat slug disposed above the upper semiconductor chip. A molding layer is disposed between the substrate and the heat slug. The molding layer is configured to seal the lower semiconductor chip and the upper semiconductor chip. An upper spacer is disposed between the lower semiconductor chip and the heat slug. The upper spacer is disposed on the exposed surface of the lower semiconductor chip.