Semiconductor Package Spacer Structure for Interposer Warp Control
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Solution Overview
Problem
The varying height of controlled collapse of chip connection (C4) standoffs in semiconductor packages can cause warping of the interposer, leading to potential damage or dislodgment of IC dies and interference with the substrate, resulting in electrical opens or shorts.
Innovation Solution
Incorporating a spacer structure mounted to the interposer to maintain a clearance between the IC die and the substrate, reducing the likelihood of interference and enhancing the robustness of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If C4 standoffs are used to provide electrical connectivity, then electrical connection is improved, but height variation causes interposer warping leading to IC die damage or dislodgment
Solution Approach 1:
The patent introduces an intermediary component (spacer or support structure) between the C4 standoffs and the IC die to compensate for height variations. This intermediary absorbs the dimensional discrepancies and prevents the interposer from warping, thereby maintaining both electrical connectivity and structural stability.
Solution Approach 2:
The patent modifies the physical parameters of the C4 standoff structure by adding spacers with specific height dimensions. This changes the effective height parameter of the connection structures, ensuring uniform support across the interposer surface and preventing warping while maintaining electrical connection reliability.
2Volume of moving object
If IC die is mounted close to substrate for compactness, then device size is reduced, but interference or collision between IC die and substrate occurs
Solution Approach 1:
The patent resolves the spatial conflict by utilizing the vertical dimension (z-axis) through spacer structures. Instead of increasing horizontal spacing, the spacers provide vertical separation, allowing the IC die to be positioned close to the substrate in the planar dimensions while maintaining adequate clearance through vertical elevation.
3Stress or pressure
If interposer flexure is allowed for stress relief, then mechanical stress is reduced, but electrical connections may open or short
Solution Approach 1:
The patent applies preliminary support actions by installing spacer structures before final assembly. These spacers pre-establish the correct geometric relationships and prevent excessive flexure from occurring during subsequent handling and operation, thereby protecting electrical connections while still allowing controlled stress relief.
Data Source
AI summary
A semiconductor package, which may correspond to a high-performance computing package, includes an interposer over a substrate. A spacer structure is mounted to a bottom surface of the interposer. The spacer structure is configured to maintain a clearance between a bottom surface of an integrated circuit die mounted to the bottom surface of the interposer and a top surface of the substrate to reduce a likelihood of an interference or collision between the integrated circuit die and the substrate. In this way, a likelihood of damage to the integrated circuit die and/or the substrate is reduced. Additionally, a robustness of an electrical connection between the integrated circuit die and the interposer may increase to improve a reliability and/or a yield of the semiconductor package including the spacer structure.