Semiconductor Package With Stacked Memory And Driving Circuit
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Solution Overview
Problem
Current semiconductor packages face challenges in meeting the increasing demand for high-resolution and high-quality display drivers, particularly due to image delays caused by long data processing times and inferior circuit pitches, which lead to defects like mura.
Innovation Solution
A semiconductor package design featuring a flexible substrate with a driving circuit and memory electrically connected through a mobile industry processor interface (MIPI), allowing for high operation speed, low power consumption, and separate manufacturing processes for the driving circuit and memory, enabling efficient handling of large image data and flexible manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If data processing time is increased to handle high-resolution display data, then image quality is improved, but image delay occurs causing defects like mura
Solution Approach 1:
The patent segments the display driver functionality into separate components: a driving circuit for processing display signals and a memory unit for storing image data. This segmentation allows the driving circuit to operate independently with reduced processing time, eliminating image delay and mura defects while maintaining high-resolution display quality through the dedicated memory unit.
2Volume of moving object
If circuit pitch is reduced to achieve smaller size, then integration is improved, but bonding pitch becomes inferior leading to manufacturing defects
Solution Approach 1:
The patent transitions from a planar integration approach to a three-dimensional stacked architecture where the memory unit is positioned vertically above the driving circuit. This dimensional change allows both components to be fully integrated within a small footprint while maintaining adequate bonding pitch, as the vertical stacking eliminates lateral bonding constraints that plague reduced-pitch designs.
3Speed
If driving circuit and memory are integrated on the same substrate, then operation speed is improved, but process flexibility is reduced
Solution Approach 1:
The patent employs preliminary action by pre-manufacturing the memory unit and driving circuit separately on different substrates using optimized processes for each component. These pre-manufactured units are then bonded together in a stacked configuration, achieving both high operation speed through close integration and process flexibility through separate manufacturing streams that can be optimized independently.
Data Source
AI summary
The present disclosure provides a semiconductor package including a substrate, a display unit, a flexible substrate, a driving circuit, and a memory. The substrate has a first surface and a second surface opposite to each other, and the first surface has a display region and a bonding region. The display unit is disposed on the display region of the first surface. The flexible substrate is disposed below the second surface and has a connection portion extended to the bonding region of the first surface. The driving circuit is disposed on the flexible substrate and electrically connects with the display unit. The memory is disposed on the flexible substrate and electrically connects with the driving circuit.