Semiconductor Package Layout With Stacked Passive Element
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Solution Overview
Problem
Existing semiconductor devices with mounted semiconductor and passive elements experience enlargement due to the placement of passive elements outward of the semiconductor element, leading to increased dimensions in the thickness direction.
Innovation Solution
A semiconductor device design featuring a substrate with embedded first and second wirings, where the passive element is located on the substrate side facing the semiconductor element and supported by columnar parts of the second wirings, allowing the passive element to overlap the semiconductor element, reducing the device's thickness direction expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the passive element is located outward of the semiconductor element in the thickness direction, then the passive element can be electrically connected to conductive patterns, but the device dimension in the thickness direction increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked arrangement where the passive element is positioned above the semiconductor element in the thickness direction. Columnar conductive parts extend vertically to provide electrical connection, enabling the passive element to be electrically connected while maintaining a compact footprint and reducing the device dimension in the thickness direction compared to lateral placement.
2Length of stationary object
If the passive element overlaps the semiconductor element in the thickness direction, then the device dimension is reduced, but the bonding area between passive element and substrate decreases
Solution Approach 1:
The patent introduces columnar conductive parts as intermediary structures that extend from the substrate through the semiconductor element to the passive element. These columnar parts serve as both electrical connection paths and bonding interfaces, providing sufficient bonding area while enabling the passive element to overlap the semiconductor element in the thickness direction, thus reducing the device dimension without compromising bonding strength.
Data Source
AI summary
A semiconductor device includes a substrate having a main surface, a plurality of first wirings, each having a first embedded part embedded in the substrate and exposed from the main surface, and a mounted part which is in contact with the main surface and is connected to the first embedded part, a semiconductor element having an element rear surface and a plurality of electrodes bonded to the mounted parts, a plurality of second wirings, each having a second embedded part embedded in the substrate and exposed from the main surface and a columnar part protruding from the second embedded part in the thickness direction, and being located outward from the semiconductor element as viewed in the thickness direction; and a passive element located on the side facing the main surface in the thickness direction more than the semiconductor element, and electrically connected to the plurality of second wirings.