Semiconductor Package Stacking for Thin Profile and Shorter Signal Paths
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Solution Overview
Problem
Semiconductor device packages face challenges in increasing performance and functionality without increasing area or thickness, which hinders connection to circuit boards.
Innovation Solution
A semiconductor device package design that includes a substrate with electronic components on both surfaces, a connection structure surrounding these components, and a package body covering them while exposing a portion for electrical connection, allowing for reduced thickness and improved signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are arranged side-by-side on substrate surfaces, then functionality and performance increase, but package area increases
Solution Approach 1:
The patent transitions from two-dimensional side-by-side component arrangement to a three-dimensional stacked arrangement where components are vertically positioned above each other on the substrate. This dimensional change allows multiple components to occupy the same footprint area, increasing functionality without expanding package area.
Solution Approach 2:
The patent implements nesting by placing electronic components within vertical cavities or recesses in the substrate, and positioning components inside package bodies that enclose connection structures. This nested arrangement maximizes space utilization and reduces overall package area.
2Area of stationary object
If electronic components are arranged in stacking arrangement, then package area is reduced, but package thickness increases
Solution Approach 1:
The patent segments the package structure into multiple functional layers including substrate, package bodies, connection structures, and encapsulation materials. Each layer performs specific functions and can be optimized independently, allowing thin-profile design while maintaining stacking arrangement benefits.
Solution Approach 2:
The patent employs thin encapsulation layers and flexible package bodies that provide protection and structural support without adding significant thickness. These thin films and shells enable the package to maintain reduced thickness while accommodating stacked components.
3Ease of operation
If package thickness is reduced, then connection to circuit board is improved, but manufacturing complexity increases
Solution Approach 1:
The patent incorporates connection structures such as conductive vias, bumps, or pads during substrate fabrication before component mounting. This preliminary formation of connection interfaces simplifies subsequent assembly steps and enables thin-profile design without compromising connection capability to circuit boards.
Solution Approach 2:
The patent merges multiple functions into integrated structures, such as combining connection structures with package bodies, or integrating antenna elements with substrate layers. This consolidation reduces the number of discrete components and assembly steps, managing manufacturing complexity while achieving reduced thickness.
Data Source
AI summary
A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.