Semiconductor Package Vertical Stacking for Miniaturization
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Solution Overview
Problem
The electronics industry faces challenges in miniaturizing semiconductor packages while maintaining high integration and performance, leading to increased manufacturing costs due to the need for smaller IC packages.
Innovation Solution
The semiconductor package design incorporates a substrate with multiple pads, conductive elements, surface mount devices, bonding wires, and a heat-sink, along with via-plugs and solder resistance layers to facilitate miniaturization and enhance design flexibility by allowing for additional components and improved routing density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high integration is implemented to reduce package size, then miniaturization is achieved, but manufacturing cost increases
Solution Approach 1:
The package structure is divided into multiple functional layers including substrate, heat-sink, surface mount devices, and conductive elements. Each layer performs specific functions independently, allowing for modular manufacturing and assembly processes that reduce overall complexity and cost despite high integration
Solution Approach 2:
The patent utilizes three-dimensional packaging architecture with components arranged in vertical stacks (substrate → heat-sink → SMDs → bonding wires). This vertical integration allows high-density component placement without proportionally increasing manufacturing complexity, as each layer can be processed independently
2Adaptability or versatility
If multiple components are integrated in a single package, then system integration density increases, but device complexity increases
Solution Approach 1:
The substrate serves multiple functions: mechanical support, electrical interconnection, and thermal management interface. The heat-sink simultaneously provides thermal dissipation and structural support. This multi-functionality reduces the number of separate components needed, simplifying the overall package structure while maintaining high integration
Solution Approach 2:
Multiple functional elements are merged into integrated structures. For example, the heat-sink is directly mounted on the substrate and serves both thermal and structural purposes. Conductive elements are integrated within the substrate layers rather than being separate components, reducing overall part count and assembly complexity
3Volume of moving object
If package size is reduced for miniaturization, then volume decreases, but area for additional elements decreases
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional vertical stacking. Components are arranged in multiple layers above and below the substrate, effectively utilizing vertical space. This allows high component density within a small footprint, maintaining adequate area for all elements while minimizing overall package volume
Solution Approach 2:
Smaller components are positioned within the vertical space created by larger components. For example, bonding wires are routed through the vertical space between substrate and SMDs, and via-plugs are embedded within the substrate thickness. This nested arrangement maximizes space utilization without requiring additional lateral area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the miniaturization of IC packages, increases area for additional elements, and enhances design flexibility, reducing manufacturing costs and improving performance by allowing for more efficient integration of components.
Implementation Method 1
a heat-sink mounted on the substrate and having at least one cavity
Implementation Method 2
a heat-sink mounted on the substrate and having at least one cavity
Implementation Method 3
The first bonding wire electrically connects a first bonding area of the first conductive element with a second bonding area of the first pad
Implementation Method 4
The solder resistance layer covers a portion of the first bonding area and a portion of the second bonding area
Data Source
AI summary
A semiconductor package includes a substrate, a conductive layer, a first surface mount device (SMD) and a bonding wire. The substrate has a t top surface. The first conductive layer is formed on the top surface and has a first conductive element and a first pad separated from each other. The first SMD is mounted on the first pad, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.