Semiconductor Package Static Electricity Prevention
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Solution Overview
Problem
Existing semiconductor devices face limitations in effectively preventing static electricity generation as they shrink in size, with current cell structure modifications offering only limited reductions in static electricity generation.
Innovation Solution
A semiconductor package design featuring a conductive pattern on a chip with conductive rods attached perpendicularly to a conductive network, which absorbs static electricity and is connected to a grounding portion for discharge, increasing the effective area for static electricity absorption and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor device size is reduced, then the device becomes more compact and suitable for modern applications, but the effectiveness of static electricity prevention is significantly reduced
Solution Approach 1:
The patent transitions from planar static prevention structures to three-dimensional structures by adding vertically extending conductive rods. This dimensional change increases the effective surface area for static electricity absorption without increasing the device's footprint, thereby maintaining compact size while improving static electricity prevention effectiveness.
Solution Approach 2:
The patent divides the static electricity prevention function into multiple independent conductive rods distributed across the device surface. Each rod acts as an independent absorption element, and their collective effect provides comprehensive coverage. This segmentation allows the system to achieve high prevention effectiveness while maintaining a compact overall structure.
2Reliability
If conventional cell structures are modified to prevent static electricity, then some static electricity reduction is achieved, but the reduction is limited and insufficient for small-sized devices
Solution Approach 1:
The conductive rods serve multiple functions: they act as static electricity absorption elements, provide electrical connection pathways, and can be integrated with existing device structures. This multi-functionality achieves superior static electricity prevention without proportionally increasing device complexity, as the same structural elements perform multiple roles.
Solution Approach 2:
The conductive rods act as intermediary elements between the device surface and the grounding system. They provide a dedicated pathway for static electricity discharge, mediating between the accumulated charge and the ground connection. This intermediary structure simplifies the overall prevention mechanism compared to complex modified cell structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces static electricity generation by increasing the effective area for absorption and ensuring efficient discharge through the conductive network and grounding portion, effectively addressing the limitations of smaller semiconductor devices.
Implementation Method 1
a conductive network attached on a surface of the chip to absorb static electricity
Implementation Method 2
a grounding portion discharging the static electricity absorbed from the conductive network
Data Source
AI summary
A semiconductor package includes a chip including a conductive pattern thereon, a conductive network attached on a surface of the chip to absorb static electricity, at least one conductive rod attached to the conductive network, wherein the at least one conductive rod is formed substantially perpendicularly to the conductive network, and a grounding portion discharging the static electricity absorbed from the conductive network.