Semiconductor Package Static Electricity Protection via Voltage-Sensitive Sealant
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Solution Overview
Problem
Semiconductor packages are vulnerable to static electricity and electrical shocks, which can damage sensitive semiconductor chips due to the buildup of electric charge, as existing technologies fail to effectively direct extra charges to a ground, potentially causing conductive pathways that harm the chips.
Innovation Solution
The semiconductor package incorporates a static electricity blocking layer and a conductive static electricity inducer connected to a ground terminal, which directs external static electricity and electrical shocks away from communication terminals, preventing damage by creating a conductive pathway only to the ground terminal through a voltage-sensitive sealant and a penetrating opening in the blocking layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive pathway is provided from the sealant to communication terminals, then electrical connection is improved, but static electricity damage risk increases
Solution Approach 1:
The patent segments the electrical connection pathways by providing separate conductive pathways: one from the sealant to communication terminals for normal operation, and another dedicated pathway from the sealant to a grounding terminal for static electricity dissipation. This segmentation allows the system to handle both signal transmission and electrostatic protection independently, preventing static electricity from damaging communication terminals while maintaining proper electrical connections.
Solution Approach 2:
The patent introduces a grounding terminal as an intermediary element that receives static electricity charges from the sealant and safely directs them to ground. This intermediary provides a controlled pathway for harmful electrostatic charges, preventing them from reaching communication terminals while allowing the sealant to maintain its insulating function for normal electrical operations.
2Object-affected harmful factors
If the sealant is made conductive to drain static electricity, then protection from static buildup is improved, but normal electrical insulation is compromised
Solution Approach 1:
The patent segments the electrical pathways by maintaining the sealant as an insulator while providing separate conductive pathways through embedded conductors or traces. These conductive pathways are routed to a grounding terminal, allowing static electricity to be drained without requiring the sealant itself to be conductive. This preserves the sealant's insulating properties for normal electrical operations while providing dedicated pathways for electrostatic discharge.
Solution Approach 2:
The patent introduces conductive pathways (such as metal traces or wires) as intermediaries between the sealant and the grounding terminal. These intermediaries provide a controlled route for static electricity to flow to ground without requiring the sealant material itself to be conductive, thus maintaining the sealant's insulating function while enabling static electricity protection.
3Object-affected harmful factors
If a static electricity blocking layer is added to prevent conductive pathways, then static electricity protection is improved, but device complexity increases
Solution Approach 1:
The patent merges the static electricity protection function with existing package components by integrating conductive pathways into the sealant structure or by using the sealant's natural properties in combination with a grounding terminal. This approach combines multiple functions (sealing, insulation, and electrostatic protection) into a unified structure, avoiding the need for separate blocking layers and reducing overall device complexity.
Solution Approach 2:
The patent makes the sealant or associated structures multi-functional by enabling them to serve both as electrical insulators for normal operations and as pathways for static electricity dissipation when connected to ground. This multi-functionality eliminates the need for separate blocking layers, as the same structural elements perform both protective and conductive functions depending on the electrical conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively protects semiconductor chips from static electricity and electrical shocks by ensuring that extra charges are safely directed to a ground, preventing damage and maintaining the integrity of the semiconductor package, even under high voltage conditions.
Implementation Method 1
a first sealant surrounding at least a portion of the semiconductor chip, the first sealant comprising a voltage sensitive material
Implementation Method 2
a static electricity blocking layer disposed between the external covering and the first inducing terminal and between the external covering and the first communication terminal, the static electricity blocking layer configured to prevent a conductive pathway from being formed between the external covering and the first communication terminal
Implementation Method 3
a static electricity inducer including a conductive material, the static electricity inducer disposed to contact the first sealant and to be electrically connected to the second terminal
Data Source
AI summary
A semiconductor package may include a substrate, a semiconductor chip disposed on the substrate, a communication terminal and a static electricity inducing terminal connected to a ground. The package may include a first sealant that comprises a voltage sensitive material and that covers the semiconductor chip and a static electricity blocking layer that provides a conductive pathway from the first sealant to only the static electric inducing terminal. The static electricity blocking layer may prevent the communication terminal from being electrically connected to the first sealant. If a buildup of charge is applied to the device, the first sealant may become polarized and/or conductive. The extra voltage may travel through the first sealant to the static electricity inducing terminal via an opening in the static electricity blocking layer. The semiconductor chip and the communication terminal may not be affected by the extra charge.