Semiconductor Package Encapsulation with Strengthening Portion
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Solution Overview
Problem
Conventional semiconductor packages with thin encapsulations face issues of insufficient strength and warpage during processing, requiring additional support systems and increasing fabrication complexity.
Innovation Solution
A method of forming a semiconductor package with a recessed encapsulation that includes a strengthening portion surrounding a recessed portion, allowing for reduced thickness while maintaining strength and flatness, and eliminating the need for additional support systems during subsequent processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the encapsulation thickness is reduced to make the semiconductor package thinner, then the package thickness is reduced, but the strength and flatness of the encapsulation become insufficient causing warpage during processing
Solution Approach 1:
The patent introduces a vertical dimension feature (protrusion) into the encapsulation structure. The protrusion extends upward from the bottom surface of the encapsulation, creating a three-dimensional reinforcement structure that adds strength without increasing the overall package thickness. This dimensional change allows the thin encapsulation to maintain sufficient mechanical strength during processing.
Solution Approach 2:
The encapsulation is segmented into different functional regions: a thin recessed portion for overall thickness reduction and a protruding strengthening portion for mechanical support. This segmentation allows different parts of the encapsulation to serve different purposes - the recessed portion minimizes thickness while the protruding portion provides localized strength enhancement at critical areas.
2Length of moving object
If the encapsulation thickness is reduced, then the package thickness is reduced, but additional wafer support systems are required increasing fabrication complexity
Solution Approach 1:
The encapsulation structure itself provides the support function that would otherwise require external wafer support systems. The protrusion acts as a self-contained strengthening mechanism embedded within the encapsulation, eliminating the need for additional support infrastructure during fabrication. The structure serves both as the encapsulation and as its own support system.
3Length of moving object
If the encapsulation thickness is reduced, then the package thickness is reduced, but bonding of RDLs with chip pads becomes difficult
Solution Approach 1:
The protrusion creates a three-dimensional structure that provides adequate bonding surface and mechanical support for RDL bonding processes. By extending upward from the encapsulation bottom surface, the protrusion ensures that chip pads remain accessible and properly supported during bonding operations, even when the overall package thickness is reduced.
Data Source
AI summary
A method of fabricating a semiconductor package includes the steps of: disposing semiconductor devices on a carrier; forming an encapsulation on the carrier to cover the semiconductor devices, a recession of the encapsulation includes a strengthening portion and a recessed portion, the strengthening portion protrudes from the recessed portion and surrounds the recessed portion; and removing the strengthening portion of the recession of the encapsulation.