Semiconductor Package Structure with Substrate Notches
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Solution Overview
Problem
Semiconductor package structures face challenges in reducing volume and thickness while maintaining signal transmission efficiency and preventing solder shift on printed circuit boards, which limits their density and reliability.
Innovation Solution
A semiconductor package structure comprising a first and second substrate with protrusions and solder receiving portions, along with a conductive pattern layer and encapsulant, is designed to minimize surface protrusion and prevent solder shift, allowing for denser arrangements and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the width of the bottom of the semiconductor package structure is reduced to decrease thickness, then the overall thickness of the electronic product is reduced, but the diameter of the lens for receiving or transmitting signals is reduced, thereby reducing the angle for signal transmitting and receiving
Solution Approach 1:
The patent transitions from a conventional planar package structure to a three-dimensional stacked architecture. The semiconductor chip is mounted on a first substrate, which is then stacked onto a second substrate that serves as the mounting substrate. This vertical stacking enables the package to achieve reduced thickness while maintaining adequate lens diameter and signal transmission angle by utilizing the third dimension (height/stacking direction) rather than compromising horizontal dimensions.
Solution Approach 2:
The package structure is divided into multiple functional layers: a first substrate containing the semiconductor chip and lens, and a second substrate serving as the mounting base. This segmentation allows the lens-containing first substrate to be positioned optimally for signal transmission while the overall package thickness is controlled by the stacking arrangement, decoupling the lens diameter requirement from the total thickness constraint.
2Length of stationary object
If the width of the bottom of the semiconductor package structure is reduced to decrease thickness, then the overall thickness of the electronic product is reduced, but the size of the electrode is reduced so that the pushing force that the electrode can bear is relatively low
Solution Approach 1:
The electrode strength problem is resolved by moving the high-stress bearing function to the second substrate, which has adequate size and structural support. The first substrate with reduced-size electrodes can focus on electrical connection while the larger second substrate provides mechanical strength and pushing force capacity, separating these functional requirements across different layers.
Solution Approach 2:
The first and second substrates are combined in a stacked configuration where their strengths complement each other. The second substrate provides both mechanical support and electrical connection capabilities, allowing the first substrate to be optimized for thinness while the overall structure maintains adequate electrode strength through the combined system.
3Stability of the object's composition
If a conventional methyl-based silicone of high thixotropy is used as the encapsulant, then the encapsulant is less likely to collapse, but the hardness of the encapsulant after being cured is insufficient and the humidity resistance or sulfur resistance is relatively poor
Solution Approach 1:
The patent employs a composite encapsulant formulation combining methyl-based silicone with phenyl-based silicone. The methyl-based component provides high thixotropy and shape stability during processing, while the phenyl-based component contributes enhanced hardness, humidity resistance, and sulfur resistance after curing. This composite approach synergistically integrates the advantages of both silicone types to overcome their individual limitations.
Solution Approach 2:
The encapsulant's chemical composition parameters are modified by adjusting the ratio and types of silicone components. By changing the chemical structure parameters (methyl vs. phenyl groups) and their proportions, the encapsulant achieves optimal balance between thixotropy (for shape stability) and cross-linking density (for hardness and environmental resistance).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall thickness of electronic products, maintains signal transmission efficiency, and prevents solder shift, enabling denser packaging and improved reliability by using substrates with protrusions and a high-thixotropy encapsulant for enhanced durability and resistance.
Implementation Method 1
the encapsulant comprises a first encapsulant and a second encapsulant... the first encapsulant has relatively high thixotropy, thereby preventing or improving the collapse of the first encapsulant when being baked at a high temperature
Data Source
AI summary
A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.