Semiconductor Package Support Structure for Stress Balancing
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Solution Overview
Problem
Semiconductor packages face challenges in achieving increased capacity, functionality, and compactness while maintaining structural integrity and preventing delamination due to imbalances in silicon content and shear stress between chips.
Innovation Solution
A semiconductor package design featuring a substrate with multiple chips, including a first chip, a second chip flip-chip bonded beside the first, and a support structure with a higher silicon content than the molding layer, which balances silicon distribution and reduces shear stress, along with spacers for enhanced stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple chips are mounted on a substrate to increase capacity and functionality, then the processing capacity and functionality are improved, but the structural integrity deteriorates due to imbalances in silicon content and shear stress between chips
Solution Approach 1:
A support structure with higher silicon content than the molding layer is introduced as an intermediary element between chips with different silicon contents. This support structure acts as a mediator to balance the overall silicon distribution in the package, reducing shear stress and preventing delamination while allowing multiple chips to be mounted for increased capacity and functionality.
Solution Approach 2:
The silicon content ratio of the support structure is specifically designed to be higher than that of the molding layer. By changing the material composition parameter (silicon content) of the support structure, the patent balances the silicon distribution imbalance caused by mounting multiple chips with different silicon contents, thereby maintaining structural integrity while increasing processing capacity.
2Adaptability or versatility
If chips with different silicon contents are mounted together to increase functionality, then the functionality is improved, but delamination occurs due to shear stress imbalance
Solution Approach 1:
The support structure serves as a mediator between chips with different silicon contents. By positioning the support structure adjacent to chips and designing it with higher silicon content, it compensates for silicon distribution imbalances and reduces shear stress at the interface between chips and molding layer, preventing delamination while allowing diverse functionality through multiple chip types.
Solution Approach 2:
The support structure is strategically positioned adjacent to specific chips with different silicon contents, creating a localized solution to the silicon distribution problem. The higher silicon content in the support structure is specifically applied where needed to balance the local silicon imbalance, allowing different functional chips to be mounted together without causing delamination.
3Volume of moving object
If a compact package design is implemented to reduce size, then the compactness is improved, but the structural stability deteriorates due to stress concentration
Solution Approach 1:
The support structure acts as a reinforcing intermediary element within the compact package. By introducing this additional structure with higher silicon content, it provides extra structural support and distributes stress more evenly throughout the package, preventing stress concentration and maintaining structural stability even in a reduced-size package design.
Data Source
AI summary
A semiconductor package includes a substrate, a first chip on the substrate, a second chip on the substrate and arranged side-by-side with the first chip, and a support structure on the second chip. A width of the support structure is equal to or greater than a width of the second chip.