Semiconductor Package Supporter Layer and Dam Structure
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Solution Overview
Problem
Current semiconductor packages face challenges in structural strength and stability, particularly when stacking multiple chips, as they lack effective reinforcement mechanisms to manage warpage and stress during packaging and testing.
Innovation Solution
A semiconductor package design that incorporates a supporter layer between upper and lower packages, surrounded by a dam to enhance structural strength, using a non-conductive material for the dam to prevent electrical interference and improve insulation or heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are stacked on one package substrate, then device integration and miniaturization are improved, but structural strength and stability deteriorate due to warpage and stress
Solution Approach 1:
The package structure is divided into multiple independent layers including lower package, supporter layer, upper package, and dam layer. This segmentation allows each layer to independently manage stress and deformation, preventing warpage while maintaining overall structural strength during stacking
Solution Approach 2:
The supporter layer acts as an intermediary between the lower and upper packages, providing mechanical support and stress distribution. The dam arranged around the supporter layer further mediates stress concentration, enabling stable stacking without compromising structural integrity
2Volume of moving object
If multiple semiconductor chips are stacked on one package substrate, then miniaturization is improved, but structural stability deteriorates due to lack of reinforcement mechanisms
Solution Approach 1:
The solution transitions from two-dimensional chip placement to three-dimensional stacking with vertical layering. The supporter layer and dam provide reinforcement in the vertical dimension, enabling miniaturization through stacking while maintaining stability through multi-dimensional structural support
3Strength
If a dam is arranged to completely surround the supporter layer, then structural strength is improved, but device complexity increases
Solution Approach 1:
The dam is implemented as a thin film-like structure that completely surrounds the supporter layer. This thin-film approach provides effective structural reinforcement and stress distribution without adding significant complexity, as the dam can be integrated into the existing package fabrication process
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a first package comprising a first substrate and a first semiconductor chip, a second package arranged on the first package, and the second package comprising a second substrate and a second semiconductor chip, a first solder ball and a supporter layer arranged between the first package and the second package, and a dam arranged between the first package and the second package, the dam being in contact with a sidewall of the supporter layer, and the dam completely surrounding the sidewall of the supporter layer.