3D Semiconductor Package Supporter Layout for Stable Low-Profile Stacking
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Solution Overview
Problem
The miniaturization and increased functionality of semiconductor device packages require integrating multiple electronic devices through 3D stacking, but supporters occupy valuable substrate area, limiting space for electronic components and posing stability challenges.
Innovation Solution
A semiconductor device package design featuring a first and second carrier with asymmetrically arranged supporters fully sealed in an encapsulant, reducing the number of supporters and maintaining structural stability without occupying additional space, allowing for more electronic components and avoiding oxidation issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If multiple supporters are used to connect carriers in 3D stacking, then structural stability is improved, but available substrate area for electronic components is reduced
Solution Approach 1:
The patent applies asymmetry by arranging supporters non-uniformly on the substrate. Instead of symmetric distribution, supporters are positioned at specific asymmetric locations optimized for structural support while maximizing available area. This asymmetric arrangement allows the package to maintain stability with fewer supporters, thereby increasing the substrate area available for electronic components.
2Stability of the object's composition
If supporters are placed close to substrate edges, then structural support is improved, but oxidation resistance is worsened due to exposure
Solution Approach 1:
The patent extracts or removes supporters from direct exposure to the external environment by fully encapsulating them within the encapsulant material. This isolation technique protects the supporters from oxidation and other environmental harmful factors while maintaining their structural support function. The encapsulant creates a protective barrier between the supporters and external oxidizing conditions.
3Object-affected harmful factors
If supporters are fully encapsulated, then oxidation resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the encapsulation process with the existing packaging manufacturing workflow. Rather than adding a separate encapsulation step, the process integrates supporter encapsulation into the standard packaging sequence, utilizing the same encapsulant material and processing conditions already employed for device encapsulation. This integration minimizes additional manufacturing complexity while achieving complete supporter protection.
Data Source
AI summary
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.