Semiconductor Package Supporting Member Structural Integrity
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Solution Overview
Problem
Conventional semiconductor packages lack sufficient support and protection, leading to damage and warpage issues during manufacturing, which affects electrical connections and results in poor yield, reliability, and high costs due to misalignment of redistribution layer structures.
Innovation Solution
A semiconductor package design that incorporates a supporting member between encapsulants to provide structural strength and protection, preventing damage and warpage, and ensuring accurate positioning of perforations, achieved through thermocompression bonding and silicon-based materials like glass or wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If carriers and connection layers are removed after encapsulation, then the package structure becomes simpler and more cost-effective, but the package units lack sufficient support and protection leading to damage and warpage
Solution Approach 1:
A supporting member is introduced as an intermediary element between the first and second encapsulants to provide structural support and protection. This supporting member acts as a mediator that maintains the mechanical integrity of the package units after carrier removal, preventing damage and warpage while enabling the simplified package structure.
2Productivity
If perforations are formed without sufficient structural support, then the manufacturing process is simpler and faster, but the positioning of perforations shifts due to encapsulant warpage causing misalignment
Solution Approach 1:
The supporting member is installed before the perforation formation process to pre-establish structural support. This preliminary action prevents encapsulant warpage during subsequent manufacturing steps, ensuring that perforations are positioned accurately without shifting, thereby maintaining manufacturing precision while enabling efficient production.
3Productivity
If redistribution layer structures are formed without adequate support, then the manufacturing process is more efficient, but electrical connections are compromised due to misalignment with conductors
Solution Approach 1:
The supporting member serves as a stable intermediary platform that maintains the relative positions of encapsulants and conductors. This stable base enables the formation of redistribution layer structures with accurate alignment to conductors, ensuring reliable electrical connections while maintaining manufacturing efficiency through a streamlined process.
4Device complexity
If no supporting member is used, then the device complexity is reduced and manufacturing cost decreases, but the package units are easily damaged and yield is poor
Solution Approach 1:
The supporting member is designed to be temporary and is removed after serving its protective function during manufacturing. This approach allows the package units to gain the necessary structural support during critical manufacturing stages while avoiding permanent addition of complex components, thereby maintaining good yield and reliability without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances structural integrity and reduces warpage, securing effective electrical connections and improving manufacturing yield and reliability by preventing damage and misalignment during the formation of redistribution structures.
Implementation Method 1
the supporting member is connected to the first encapsulant by thermocompression bonding
Data Source
AI summary
A semiconductor package and a method of manufacturing the same are provided, the semiconductor package including a first package unit having a first encapsulant and a first semiconductor element, a second package unit having a second encapsulant and a second semiconductor element, a supporting member interposed between the first and second encapsulant, a plurality of conductors penetrating the first encapsulant, the supporting member and the second encapsulant, and redistribution structures disposed on the first and second encapsulants, wherein the first and second encapsulants are coupled with each other by the supporting member to provide sufficient support and protection to enhance the structure strength of the first and second package units.