Semiconductor Package Thermal Structure With TEG-Powered Cooling

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Solution Overview

Problem

As semiconductor components become more densely integrated, heat dissipation becomes a significant challenge, particularly in high-power packages, leading to inefficiencies in thermal management and increased energy consumption.

Innovation Solution

Utilizing thermoelectric generators (TEGs) to convert waste heat from high-power packages into electrical power, which is then used to operate thermal management components like cooling fans for low-power packages, combined with structures such as vapor chambers, heat pipes, and liquid cooling systems for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If thermoelectric generators are used to convert waste heat into electrical power, then energy consumption for thermal management is reduced, but device complexity increases

Engineering Contradiction:

Improveenergy consumption for thermal managementVSAvoiddevice complexity

Core Design Contradiction:

Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent converts waste heat, which is normally a harmful byproduct requiring active cooling, into useful electrical energy through thermoelectric generators. This allows the system to power cooling fans and other thermal management components using energy that would otherwise be lost, thereby reducing overall energy consumption while managing heat effectively

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The system uses its own waste heat to generate the electrical power needed for its thermal management components. The high-power packages generate heat that is converted by TEGs into electricity that powers cooling fans for low-power packages, creating a self-sustaining thermal management system that reduces external power requirements

Inventive Principle:

Principle #25Self-service

2Productivity

If integration density is increased by reducing minimum feature size, then productivity is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent transforms the excessive heat generated by high integration density, which is normally a problem to be dissipated, into a resource that generates electrical power. The thermoelectric generators capture the thermal energy from high-power packages and convert it to electricity, turning the heat dissipation challenge into an energy recovery opportunity

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent combines multiple functions into a single integrated system: heat dissipation, energy generation, and power supply for cooling components. The thermal management system integrates TEGs, cooling fans, and heat dissipation structures into a unified architecture that simultaneously manages heat and generates power

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces energy consumption and cost for thermal management by converting waste heat into electricity, enhancing the efficiency of heat dissipation across varying power packages within a computing system.

Implementation Method 1

a thermoelectric system sandwiched between the high-power package and the liquid cooling system... the thermoelectric system provides the first heat dissipation device with electrical power during operation of the high-power package

Methodology Applied

Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

structures such as vapor chambers, heat pipes, and liquid cooling systems for efficient heat dissipation

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

structures such as vapor chambers, heat pipes, and liquid cooling systems for efficient heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250210458A1Thermal structure for semiconductor package

Publication Date: 2025.06.26 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a high-power package attached to a substrate; a first low-power package attached to the substrate; a first heat dissipation device attached to the first low-power package; a liquid cooling system attached to the high-power package; and a thermoelectric system sandwiched between the high-power package and the liquid cooling system, wherein the thermoelectric system is electrically connected to the first heat dissipation device, wherein the thermoelectric system provides the first heat dissipation device with electrical power during operation of the high-power package.