Semiconductor Package Encapsulation with Removable Temporary Layer

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Solution Overview

Problem

Conventional semiconductor packages are costly, unreliable, and have large package sizes, which hinder efficient manufacturing and performance.

Innovation Solution

A method involving the formation of first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material, which includes coupling semiconductor dies to a substrate, forming encapsulating materials, and removing temporary carriers to optimize package size and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing cost is high, but reliability is low and package size is large

Engineering Contradiction:

ImprovereliabilityVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent removes the second encapsulating material entirely after it serves its temporary protective function during manufacturing. This extraction of the non-essential component reduces the final package size while maintaining reliability through the first encapsulating material that remains.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The encapsulation is divided into two distinct materials: a first encapsulating material that remains in the final product for protection, and a second encapsulating material that is temporarily applied and then completely removed. This segmentation allows optimization of each material's function, reducing overall package size.

Inventive Principle:

Principle #1Segmentation

2Reliability

If conventional semiconductor packages are used, then manufacturing cost is high, but reliability is low

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The second encapsulating material is used as a disposable temporary component during manufacturing. It provides necessary protection during the manufacturing process but is then completely removed, allowing the use of lower-cost materials for temporary protection while maintaining high reliability in the final product through careful selection of the permanent first encapsulating material.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Strength

If second encapsulating material is used during manufacturing, then structural integrity is maintained, but final package size increases

Engineering Contradiction:

Improvestructural integrityVSAvoidpackage size

Core Design Contradiction:

StrengthVSVolume of stationary object

Solution Approach 1:

The second encapsulating material is applied in advance during manufacturing to provide structural integrity and protection. After serving this preliminary protective function, it is completely removed, leaving only the essential first encapsulating material that maintains adequate structural integrity at a smaller size.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20240087914A1Method of manufacturing an electronic device and electronic device manufactured thereby

Publication Date: 2024.03.14 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.