Semiconductor Package Encapsulation with Removable Temporary Molding
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Solution Overview
Problem
Conventional semiconductor packages and manufacturing methods result in excessive costs, decreased reliability, and larger package sizes, which are inadequate for modern electronic device requirements.
Innovation Solution
A method involving the formation of first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material, which includes coupling semiconductor dies to a substrate, forming encapsulating materials, and removing temporary carriers to enhance manufacturability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages and manufacturing methods are used, then manufacturing process is established, but costs are excessive and reliability is decreased
Solution Approach 1:
The patent extracts and removes the second encapsulating material after it has served its protective function during manufacturing. This extraction eliminates unnecessary material that would otherwise increase package size and cost, while the first encapsulating material remains to provide ongoing protection, thereby improving reliability without excessive cost
Solution Approach 2:
The second encapsulating material is discarded after completing its temporary protective role. By discarding this material post-manufacturing, the patent reduces package size and cost while maintaining the essential protective function through the first encapsulating material, resolving the contradiction between reliability and manufacturing cost
2Reliability
If conventional semiconductor packages are used, then package protection is provided, but package sizes are too large
Solution Approach 1:
The second encapsulating material is extracted and removed after manufacturing. This extraction reduces the overall package volume while maintaining essential protection through the first encapsulating material, directly addressing the contradiction between package protection and package size
Solution Approach 2:
The patent applies encapsulation locally and selectively - the first encapsulating material provides permanent protection where needed, while the second encapsulating material provides temporary protection during manufacturing only. This localized approach to protection reduces overall package size while maintaining necessary reliability
3Ease of manufacture
If multiple encapsulating materials are formed, then manufacturing flexibility is increased, but processing complexity increases
Solution Approach 1:
The second encapsulating material is removed after serving its manufacturing purpose. This extraction simplifies the final device structure and reduces processing complexity in subsequent steps, while the flexibility gained during manufacturing from using two materials is preserved
Solution Approach 2:
The second encapsulating material is applied preliminarily during manufacturing to enable flexible processing steps. After serving this preliminary protective function, it is removed, having fulfilled its temporary role. This preliminary action provides manufacturing flexibility without permanently increasing device complexity
Data Source
AI summary
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an electronic device, and electronic devices made thereby, that comprise forming first and second encapsulating materials, followed by further processing and the removal of the entire second encapsulating material.