Semiconductor Package Terminal Layout for Crosstalk-Resistant Memory Modules
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Solution Overview
Problem
Existing semiconductor packages face challenges in reducing crosstalk between connection terminals, which affects signal integrity and reliability, particularly in two-dimensional array structures.
Innovation Solution
The semiconductor package employs a two-dimensional array structure for connection terminals, arranging DQ and CA terminals in a diagonal direction and incorporating ground terminals to minimize crosstalk, with a dovetail joint structure between channel regions to enhance signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If connection terminals are arranged in a two-dimensional array structure, then the density and capacity of the semiconductor package are improved, but crosstalk between terminals increases affecting signal integrity
Solution Approach 1:
The patent segments the two-dimensional terminal array into multiple channel regions (first channel region, second channel region, etc.) with alternating orientations. Each channel region contains terminals arranged in a specific direction (first direction or second direction), creating distinct signal pathways that reduce electromagnetic interference and crosstalk between adjacent terminals while maintaining high density.
Solution Approach 2:
The patent employs asymmetric arrangement where adjacent channel regions have different terminal orientation patterns. The first channel region has terminals arranged in the first direction while the second channel region has terminals arranged in the second direction perpendicular to the first. This asymmetric, alternating pattern disrupts the regular grid structure that causes crosstalk, thereby improving signal integrity while preserving terminal density.
2Reliability
If DQ and CA terminals are arranged in diagonal direction, then crosstalk is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the terminal array into discrete channel regions with uniform internal patterns. Within each channel region, terminals are arranged in a simple linear fashion along one direction. The diagonal arrangement emerges from the alternating orientation of adjacent regions rather than complex individual terminal positioning, simplifying the manufacturing process while achieving crosstalk reduction.
Solution Approach 2:
The patent combines simple linear terminal arrangements within each channel region to create the overall diagonal pattern. By merging multiple simple linear arrays with alternating orientations, the system achieves the crosstalk-reducing diagonal effect without requiring complex manufacturing for each individual terminal position.
3Reliability
If channel regions are coupled in dovetail joint structure, then signal integrity is enhanced, but device complexity increases
Solution Approach 1:
The dovetail joint structure creates an asymmetric coupling between channel regions, with interlocking features that provide mechanical stability and electrical continuity. This asymmetric design enhances signal integrity by ensuring proper alignment and connection between regions while the modular nature keeps the overall device complexity manageable through standardized interface patterns.
Data Source
AI summary
Provided is a semiconductor package with high reliability signal characteristics and a memory module including the semiconductor package. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, and connection terminals arranged on a lower surface of the package substrate. The connection terminals are arranged in a two-dimensional array structure in a first direction and a second direction perpendicular to the first direction, and two adjacent terminals with a shortest distance therebetween among data signal (DQ) terminals and command and address signal (CA) terminals included in the connection terminals are arranged in a diagonal direction between the first direction and the second direction.