Semiconductor Package Layout With Overlapping Terminal Footprint
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Solution Overview
Problem
The existing semiconductor apparatuses have a large footprint, which is a challenge for in-vehicle applications where size reduction is necessary.
Innovation Solution
The semiconductor apparatus design includes a heatsink plate with a substrate, circuit pattern, semiconductor chip, case, and terminal, where the circuit pattern overlaps the terminal in a plan view, reducing the footprint by overlapping areas, and utilizing a wide band-gap semiconductor chip for high voltage and low on-resistance, suitable for in-vehicle use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the terminal is positioned separately from the circuit pattern in conventional designs, then the electrical connection is reliable, but the footprint area is large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement where terminals and circuit patterns are separated to a three-dimensional overlapping arrangement. The terminal is positioned to overlap with the circuit pattern in the plan view, utilizing the vertical dimension to achieve spatial efficiency while maintaining electrical connection reliability through proper wire routing and bonding.
Solution Approach 2:
The patent merges the terminal position with the circuit pattern area, allowing the terminal to be located within the boundary defined by the circuit pattern. This overlapping arrangement combines the functions of terminal mounting and circuit layout into a shared spatial region, thereby reducing the overall footprint area.
2Area of stationary object
If the footprint is reduced by overlapping components, then the device size is smaller, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary positioning actions during the manufacturing process. The substrate is first mounted on the heatsink plate at a predetermined position, and the terminal is attached to the case at a position that overlaps with the circuit pattern. These preliminary positioning steps establish the spatial relationships before wire bonding, ensuring that subsequent wire routing and bonding operations can be performed with appropriate precision.
Solution Approach 2:
The patent applies local quality by ensuring that the overlapping region between the terminal and circuit pattern is specifically designed and controlled. The wire routing paths are carefully planned to connect the terminal to the circuit pattern through the overlapping area, with localized attention to maintaining appropriate wire lengths and bonding positions to achieve the required manufacturing precision.
Data Source
AI summary
A semiconductor apparatus includes a heatsink plate, a substrate disposed on the heatsink plate, a circuit pattern disposed on the substrate, a semiconductor chip disposed on the circuit pattern, a case fixed to the heatsink plate and surrounding an outer perimeter of the substrate, a terminal attached to the case, and a wire configured to electrically connect the terminal to the circuit pattern or to the semiconductor chip. In a plan view as viewed in the thickness direction of the heatsink plate, a portion of the circuit pattern overlaps the terminal.