Semiconductor Package Test Line Layout for EMI and ESD Protection
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Solution Overview
Problem
Existing semiconductor packages face challenges in improving electrical properties, particularly in addressing electromagnetic interference (EMI) and electrostatic discharge (ESD), which affect the performance and reliability of semiconductor chips.
Innovation Solution
The semiconductor package incorporates a test line design with a separated test pattern that extends between the film substrate and the semiconductor chip, alleviating EMI and ESD by enhancing the electrical connectivity and protection of the chip through a loop-shaped test line configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional test line design is used in semiconductor packages, then the manufacturing process is simple, but the electrical properties are degraded due to electromagnetic interference and electrostatic discharge
Solution Approach 1:
The test line is divided into two separate parts: a first part extending from the first connection pattern to the semiconductor chip, and a second part extending from the second connection pattern to the test pattern. This segmentation allows each part to be independently optimized for its specific function, reducing the overall impact of EMI and ESD on the test signal path.
Solution Approach 2:
The semiconductor chip acts as an intermediary element between the first and second connection patterns. The test line routing through the chip provides an indirect path that isolates the test signal from direct exposure to electromagnetic interference and electrostatic discharge that would affect a conventional direct test line configuration.
2Reliability
If the test line is extended to improve testing capability, then the test coverage is enhanced, but the exposure to electromagnetic interference and electrostatic discharge increases
Solution Approach 1:
Different sections of the test line have different routing configurations optimized for their local requirements. The first part of the test line is routed to provide adequate test coverage while the second part is configured to minimize exposure to harmful electromagnetic and electrostatic factors in the surrounding area.
Data Source
AI summary
A semiconductor package includes a film substrate, a plurality of first connection patterns and a plurality of second connection patterns disposed in a first direction on the film substrate, a semiconductor chip between the first and second connection patterns, a protection pattern on the film substrate and at least partially surrounding the semiconductor chip, a plurality of pads between the film substrate and the semiconductor chip, a test pattern between the film substrate and the protection pattern, a plurality of first lines respectively coupled with the plurality of first connection patterns, a plurality of second lines respectively coupled with the plurality of second connection patterns, and a test line extending from a second line of the plurality of second lines and coupled with the test pattern. The test line includes a first part coupled with the second line, and a second part coupling the first part with the test pattern.