Semiconductor Package Thermal Balancing for Uneven Device Heating
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Solution Overview
Problem
In semiconductor packages, uneven heat distribution among devices can lead to reduced efficiency and reliability, as well as the risk of thermal runaway due to temperature gradients.
Innovation Solution
A semiconductor package design that includes a thermally conductive layer and at least two semiconductor devices, with a temperature balancing element arranged in thermal connection with both the thermally conductive layer and the semiconductor devices to reduce temperature gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If semiconductor devices are arranged in thermal connection with a thermally conductive layer, then heat dissipation is improved, but temperature gradients between devices increase leading to uneven heat distribution
Solution Approach 1:
The patent introduces temperature balancing elements with specific thermal conductivity properties positioned between the thermally conductive layer and selected semiconductor devices. These elements create localized thermal pathways that selectively conduct heat away from devices running hot, thereby equalizing temperatures across all devices while maintaining overall heat dissipation efficiency.
2Loss of energy
If heat is transferred from one semiconductor device to another, then heat dissipation is enhanced, but temperature gradients increase causing uneven current distribution
Solution Approach 1:
The temperature balancing elements act as intermediary components between the semiconductor devices and the thermally conductive layer. These intermediaries selectively mediate heat transfer from specific devices that generate excessive heat, preventing thermal runaway while allowing normal heat dissipation from other devices, thus maintaining uniform current distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively balances heat distribution among semiconductor devices, enhancing the long-term reliability and efficiency of the semiconductor package by reducing temperature gradients and preventing thermal runaway.
Implementation Method 1
the thermally conductive layer is configured to dissipate at least a part of said heat
Implementation Method 2
the at least one temperature balancing element being arranged in thermal connection i) with the thermally conductive layer and ii) with at least one of the at least two semiconductor devices so as to reduce a temperature gradient between the at least two semiconductor devices
Data Source
AI summary
A semiconductor package comprises: a thermally conductive layer and semiconductor devices thermally connected with the thermally conductive layer. The semiconductor devices produce heat, which the thermally conductive layer dissipates at least partly. Some heat is transferred from a semiconductor device to another semiconductor device. The semiconductor package further comprises a temperature balancing element arranged in thermal connection i) with the thermally conductive layer and ii) with the other semiconductor device(s).