Semiconductor Package Conductive Structure for Faster Thermal Dissipation
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Solution Overview
Problem
The challenge in semiconductor manufacturing is to enhance thermal conduction and reduce manufacturing time and cost while maintaining the reliability of semiconductor packages, particularly in the context of 3D packaging and 3DIC devices.
Innovation Solution
Incorporating an electrically conductive adhesive structure between the rear surface of a semiconductor die and a routing structure, which forms a eutectic bond for improved thermal conduction, and using a curing time that is significantly shorter than conventional die attach films to reduce manufacturing time and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional die attach films are used, then the semiconductor package can be manufactured with standard processes, but the curing time is long and thermal conduction is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive material from conventional die attach film composition to epoxy-based conductive adhesive composition, which enables both faster curing and improved thermal conduction properties
Solution Approach 2:
The patent uses a composite material system consisting of epoxy resin as base material, conductive fillers (such as metal particles or flakes), and curing agents, which combines the advantages of fast curing with high thermal conductivity in a single adhesive layer
2Productivity
If conventional die attach films are used, then the manufacturing process is simple, but the manufacturing time and cost are high
Solution Approach 1:
The patent modifies the curing parameters of the adhesive material by using epoxy-based formulations that cure faster than conventional die attach films, directly reducing the manufacturing cycle time and improving overall productivity
3Temperature
If electrically conductive adhesive structure is used, then thermal conduction is improved, but the device structure becomes more complex
Solution Approach 1:
The patent makes the adhesive structure multi-functional by incorporating both electrical conductivity and thermal conduction properties into a single electrically conductive adhesive layer, eliminating the need for separate thermal management layers and thus not increasing overall device complexity
Solution Approach 2:
The conductive adhesive uses composite materials containing conductive fillers within an epoxy matrix, which simultaneously provides electrical conductivity for signal transmission and thermal conductivity for heat dissipation, achieving multiple functions in one layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the thermal dissipation of semiconductor packages, improves reliability, and reduces manufacturing time and costs by leveraging a faster curing process for the conductive adhesive.
Implementation Method 1
Incorporating an electrically conductive adhesive structure between the rear surface of a semiconductor die and a routing structure, which forms a eutectic bond for improved thermal conduction
Data Source
AI summary
A semiconductor package includes a first redistribution circuit structure, a semiconductor die, and an electrically conductive structure. The semiconductor die is disposed over and electrically coupled to the first redistribution circuit structure. The electrically conductive structure connects a non-active side of the semiconductor die to a conductive feature of the first redistribution circuit structure, where the semiconductor die is thermally coupled to the first redistribution circuit structure through the electrically conductive structure, and the electrically conductive structure includes a structure of multi-layer with different materials.