Semiconductor Package Thermal Conductive Element Heat Dissipation
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Solution Overview
Problem
The challenge in semiconductor packaging is effectively dissipating heat generated by multiple dice in a package without increasing the package size, while maintaining cost-effectiveness and performance.
Innovation Solution
The semiconductor package incorporates a thermal conductive element and a molding compound that covers the side surfaces of the substrate and semiconductor devices, with the molding compound being coplanar or partially covering the thermal conductive element to enhance heat dissipation without compromising the package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple dice are packaged in one package, then packaging density and cost-effectiveness are improved, but heat dissipation becomes more difficult without increasing package size
Solution Approach 1:
The patent introduces a thermal conductive element positioned above the semiconductor devices, utilizing the vertical dimension (Z-axis) for heat dissipation. This allows heat to be conducted upward away from the densely packed dice without increasing the horizontal footprint of the package, effectively resolving the contradiction between high packaging density and heat dissipation capability.
Solution Approach 2:
The thermal conductive element acts as an intermediary between the heat-generating semiconductor devices and the external environment. It provides a dedicated thermal pathway that mediates the heat transfer process, enabling effective heat dissipation from multiple dice without requiring increased package area.
2Temperature
If a thermal conductive element is added above semiconductor devices, then heat dissipation is improved, but package complexity increases
Solution Approach 1:
The thermal conductive element serves multiple functions: it provides thermal conduction pathways, acts as a structural support component, and can be integrated with existing package substrates. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in package complexity while achieving improved heat dissipation.
3Stability of the object's composition
If molding compound covers thermal conductive element, then structural integrity and security are improved, but heat dissipation efficiency may be reduced
Solution Approach 1:
The molding compound selectively covers only portions of the thermal conductive element, leaving exposed regions that serve as heat dissipation surfaces. This local quality approach ensures structural integrity where coverage is needed while maintaining thermal efficiency where exposure is provided, resolving the contradiction between security and heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation capabilities while maintaining the package's footprint size, securing the thermal conductive element, and offering flexibility in packaging options for various applications.
Implementation Method 1
a thermal conductive element. The thermal conductive element is disposed above the semiconductor device
Data Source
AI summary
The present disclosure relates to a semiconductor package. In an embodiment, the semiconductor package includes a substrate having a lateral surface and an upper surface, a semiconductor device mounted to the substrate, and a molding compound covering the lateral surface and the upper surface of the substrate and at least a portion of the semiconductor device. A surface of the semiconductor device is substantially coplanar with a surface of the molding compound.