Semiconductor Package Thermal Inspection for Molding Layer Thickness
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Solution Overview
Problem
Existing semiconductor inspection methods struggle to accurately measure the thickness of molding layers and detect defects such as voids in semiconductor packages without causing damage, and they lack the ability to non-destructively assess the internal state of these packages.
Innovation Solution
A semiconductor inspection apparatus and method using a combination of a 3D sensing device, a heating device, and a thermal image capture device to analyze the top surface of a semiconductor package, allowing for the measurement of molding layer thickness and detection of defects by analyzing thermal image data and 3D shape data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods are used to measure molding layer thickness, then the inspection process is simple, but the measurement precision is insufficient and cannot accurately measure thickness distribution
Solution Approach 1:
The patent applies parameter changes by utilizing thermal conductivity differences as a physical parameter to enable precise thickness measurement. The heating device irradiates the semiconductor package, and the thermal image capture device detects temperature distribution changes caused by varying thermal conductivity in different regions, which directly correlates to molding layer thickness variations. This transforms the measurement approach from direct geometric measurement to indirect thermal property-based measurement, achieving high precision without complex mechanical contact.
Solution Approach 2:
The patent replaces mechanical measurement systems with a thermal-field-based inspection system. Instead of using physical probes or contact式 measurement tools, the system uses a heating device to generate thermal energy and a thermal image capture device to detect thermal radiation patterns. This substitution eliminates mechanical complexity while enabling non-contact, high-precision thickness measurement through thermal field analysis.
2Reliability
If conventional inspection methods are used to detect internal defects, then the inspection process is non-invasive, but the ability to detect voids and internal defects is insufficient
Solution Approach 1:
The patent utilizes changes in thermal parameters (temperature distribution, thermal conductivity) to detect internal defects. When the heating device irradiates the semiconductor package, regions with voids or defects exhibit different thermal response characteristics compared to normal regions. The thermal image capture device records these temperature distribution patterns, and by analyzing the thermal parameter variations, the system can identify and locate internal defects without physical contact or destruction of the package.
3Measurement precision
If destructive inspection methods are used to assess internal state, then the inspection accuracy is high, but the semiconductor package is damaged
Solution Approach 1:
The patent replaces destructive mechanical or physical dissection methods with a non-contact thermal field inspection system. The heating device and thermal image capture device form a remote sensing system that measures internal characteristics through thermal radiation detection. This substitution allows high-precision measurement of internal state (molding layer thickness, defect locations) without any physical contact or damage to the semiconductor package, maintaining product integrity while achieving accurate inspection.
4Measurement precision
If region-specific thermal analysis is performed, then the measurement precision for chip region is improved, but the analysis time increases
Solution Approach 1:
The patent applies segmentation by dividing the semiconductor package top surface into distinct regions (chip region and non-chip region) for separate thermal analysis. The controller processes thermal image data by analyzing temperature distribution characteristics specific to each region, applying region-appropriate algorithms to determine thickness data. This segmentation enables focused, efficient processing that improves precision for each region while managing overall analysis time through targeted rather than exhaustive processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise, non-destructive measurement of molding layer thickness and detection of defects, improving manufacturing yield by identifying issues like voids and ensuring the integrity of semiconductor packages.
Implementation Method 1
heating a top surface of a semiconductor package; capturing the top surface of the heated semiconductor package to obtain thermal image data
Implementation Method 2
capturing the top surface of the heated semiconductor package to obtain thermal image data about the top surface of the semiconductor package
Data Source
AI summary
Disclosed are semiconductor inspection apparatuses, systems, and methods. The semiconductor inspection method comprises heating a top surface of a semiconductor package, capturing the top surface of the heated semiconductor package to obtain thermal image data, and analyzing the thermal image data. The analyzing the thermal image data includes analyzing first thermal image data about the top surface at a first region of the semiconductor package, and analyzing second thermal image data about the top surface at a second region of the semiconductor package. The analyzing the first thermal image data includes obtaining first region data about temperature distribution at the top surface of the first region, and using the first region data to obtain thickness data of a cover molding layer about thickness distribution of the molding layer on the chip in the first region.