Semiconductor Package Module With Composite Thermal Interface Cooling
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Solution Overview
Problem
The challenge of effectively dissipating heat from high-power electronic devices to prevent overheating and malfunction is significant, particularly in devices with high computational ability, where power consumption leads to substantial thermal energy generation.
Innovation Solution
The implementation of a semiconductor package module design that includes a heat spreader attached to the device die and die stacks via a composite thermal interfacial layer, which is further connected to a package substrate through a ring structure, utilizing materials with high thermal conductivity and enhanced with wicking structures for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power electronic devices are used to increase computational ability, then processing speed and computational power are improved, but thermal energy generation increases causing overheating and malfunction
Solution Approach 1:
The patent extracts thermal energy from the electronic device by introducing a heat spreader that is thermally coupled to the device die. The heat spreader absorbs and conducts heat away from the heat-generating components, effectively removing thermal energy from the system to prevent overheating while maintaining high computational power
Solution Approach 2:
The patent introduces a heat spreader as an intermediary component between the device die and the external environment. This heat spreader acts as a thermal mediator that facilitates heat transfer from the device die through composite thermal interfacial layers to heat dissipation structures, enabling efficient thermal management without compromising computational performance
2Temperature
If heat dissipation structures are added to manage thermal energy, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple thermal management functions into an integrated heat spreader assembly. The heat spreader is combined with composite thermal interfacial layers, wicking structures, and heat dissipation structures into a unified package module, achieving effective heat dissipation while reducing the number of separate components and simplifying the overall device structure
Solution Approach 2:
The heat spreader serves multiple functions simultaneously: it acts as a thermal conductor to transfer heat from the device die, provides structural support for the package module, and facilitates heat distribution to multiple heat dissipation pathways. This multi-functionality reduces the need for additional dedicated components, thereby reducing device complexity while maintaining effective temperature control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency by reducing thermal resistance and providing a direct conductive path for heat transfer, effectively managing thermal energy generated by the electronic components.
Implementation Method 1
a heat spreader attached to the device die and die stacks via a composite thermal interfacial layer
Implementation Method 2
enhanced with wicking structures for improved heat dissipation
Data Source
AI summary
An electronic apparatus, a semiconductor package module and a method for manufacturing the semiconductor package module are provided. The semiconductor package module includes: an encapsulated structure, including a device die and an encapsulant laterally enclosing the device die; a package substrate, attached to a first side of the encapsulated structure; a composite thermal interfacial structure, disposed on a second side of the encapsulated structure, and including thermally conductive elements arranged side by side or stacked along a vertical direction; a ring structure, attached to the package substrate and laterally surrounding the encapsulated structure; and a heat spreader, attached to the second side of the encapsulated structure through the composite thermal interfacial structure, and supported by the ring structure.