Semiconductor Package Thermal Layer for Simpler Heat Dissipation
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Solution Overview
Problem
Semiconductor chips with improved integration and functionality generate more heat, necessitating effective heat dissipation to prevent thermal expansion and enhance device performance and reliability, but existing methods complicate manufacturing processes and increase costs.
Innovation Solution
A semiconductor package design featuring a substrate with semiconductor chips, a molding material, a thermal conductive adhesive, and a thermal conductive layer with varying surface roughness, along with a simplified manufacturing method involving a carrier structure and debonding process to improve heat dissipation and reduce manufacturing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal paste is attached to the completed semiconductor package to improve heat dissipation characteristics, then heat dissipation performance is improved, but the manufacturing process becomes complicated and requires additional time and cost
Solution Approach 1:
The thermal conductive adhesive is applied to the carrier structure before the semiconductor chip is mounted on the substrate. This preliminary application of the thermal conductive adhesive eliminates the need for subsequent thermal paste attachment, simplifying the manufacturing process while maintaining effective heat dissipation from the semiconductor chip surface.
Solution Approach 2:
The thermal management function is extracted from the final packaging stage and integrated into the carrier structure used during mounting. By incorporating the thermal conductive adhesive on the carrier structure, the heat dissipation function is built-in from the beginning, removing the need for separate thermal paste application and reducing process complexity.
2Temperature
If thermal paste is attached to improve heat dissipation, then heat dissipation performance is improved, but manufacturing time and cost increase
Solution Approach 1:
The thermal conductive adhesive is applied to the carrier structure before the semiconductor chip is mounted on the substrate. This preliminary application of the thermal conductive adhesive eliminates the need for subsequent thermal paste attachment, simplifying the manufacturing process while maintaining effective heat dissipation from the semiconductor chip surface.
Solution Approach 2:
The mounting process and thermal interface application are merged into a single step. The thermal conductive adhesive is already present on the carrier structure when the chip is mounted, combining the mechanical support function and thermal management function into one integrated process, thereby reducing manufacturing time.
3Temperature
If thermal paste is attached to improve heat dissipation, then heat dissipation performance is improved, but additional process risks occur
Solution Approach 1:
The thermal conductive adhesive is applied to the carrier structure before the semiconductor chip is mounted on the substrate. This preliminary application of the thermal conductive adhesive eliminates the need for subsequent thermal paste attachment, simplifying the manufacturing process while maintaining effective heat dissipation from the semiconductor chip surface.
Solution Approach 2:
The carrier structure is designed to self-provide the thermal interface material through its integrated thermal conductive adhesive layer. This eliminates the need for separate thermal paste application processes and associated quality control risks, as the thermal interface is already in place and properly positioned during the mounting process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation characteristics while shortening the manufacturing turnaround time and reducing costs by simplifying the process, thereby improving device performance and reliability.
Implementation Method 1
a thermal conductive adhesive on the semiconductor chip and the molding material; and a thermal conductive layer on the thermal conductive adhesive
Implementation Method 2
a thermal conductive adhesive on the semiconductor chip and the molding material; and a thermal conductive layer on the thermal conductive adhesive
Data Source
AI summary
A semiconductor package including a substrate; a semiconductor chip on the substrate and electrically connected to the substrate; a molding material on the substrate that molds the semiconductor chip; a thermal conductive adhesive on the semiconductor chip and the molding material; and a thermal conductive layer on the thermal conductive adhesive. A first surface of the thermal conductive layer faces the thermal conductive adhesive. A second surface of the thermal conductive layer which is opposite the first surface of the thermal conductive layer has a higher surface roughness value than the first surface.