Semiconductor Package Thermal Conducting Material Containment
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Solution Overview
Problem
The existing heat dissipation structures in semiconductor package devices face issues due to thermal conducting material melting and dissipating during manufacturing temperature cycles, leading to insufficient heat dissipation performance.
Innovation Solution
A semiconductor package device design that incorporates a ring frame or barrier cap to contain thermal conducting material between the semiconductor die and a heat dissipating structure, enhancing heat dissipation by preventing material loss and ensuring effective thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conducting material is placed between semiconductor die and heat dissipating structure, then heat dissipation performance is improved, but during manufacturing temperature cycles the material melts and dissipates causing insufficient heat dissipation
Solution Approach 1:
A ring frame structure acts as an intermediary component between the semiconductor die and heat dissipating structure. This ring frame contains the thermal conducting material in a recessed space, preventing it from melting and dissipating during manufacturing temperature cycles while maintaining effective thermal contact during operation.
Solution Approach 2:
The ring frame with its recessed space is prepared in advance before the thermal conducting material is applied. This preliminary structural preparation ensures that when the thermal conducting material is placed, it is immediately contained and protected from displacement during subsequent manufacturing processes including temperature cycling.
2Temperature
If thermal conducting material is applied generously to ensure heat dissipation, then heat dissipation performance is improved, but the material spreads during manufacturing causing excess material loss
Solution Approach 1:
The ring frame serves as a containment intermediary that restricts the thermal conducting material within its recessed space. This prevents the material from spreading beyond the required area during manufacturing processes, ensuring both adequate heat dissipation and material conservation.
Solution Approach 2:
The ring frame creates a localized containment zone with specific geometric boundaries. The recessed space provides exactly the right amount of space for the thermal conducting material, ensuring sufficient thermal conductivity where needed while preventing excess material displacement and loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The containment of thermal conducting material by the ring frame or barrier cap improves heat dissipation performance by maintaining material integrity during manufacturing processes and enhancing thermal conductivity between the semiconductor components and heat dissipating structures.
Implementation Method 1
thermal conducting material is disposed in the space... enhances thermal conductivity between the semiconductor components and heat dissipating structures
Data Source
AI summary
A semiconductor package device includes a substrate, an electronic component, a ring frame, an encapsulant, a thermal conducting material and a lid. The electronic component is disposed on the substrate. The ring frame is disposed on the substrate and surrounds the electronic component. The encapsulant encapsulates the electronic component and a first portion of the ring frame. The encapsulant exposes a second portion of the ring frame. The encapsulant and the second portion of the ring frame define a space. The thermal conducting material is disposed in the space. The lid is disposed on the thermal conducting material and connects with the second portion of the ring frame.