Semiconductor Package Thermal Path for Wiring Board Heat Dissipation
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Solution Overview
Problem
In semiconductor devices with high output, heat generated from both the semiconductor package and the wiring board is not efficiently dissipated to the heat dissipation member, leading to potential overheating issues.
Innovation Solution
A semiconductor device configuration that includes a wiring board with a heat dissipation pattern connected to a semiconductor package via a heat dissipation connection member, which is thermally connected to an insulating heat dissipation substrate, allowing for effective heat transfer from the wiring board to the heat dissipation member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high output is achieved in semiconductor devices, then power and performance are improved, but heat generation increases causing overheating issues
Solution Approach 1:
The heat dissipation function is segmented into multiple independent paths: one path through the heat dissipation substrate connected to the semiconductor package, and another path through the heat dissipation pattern on the wiring board. This segmentation allows heat from different sources to be dissipated separately and efficiently, resolving the overheating issue while maintaining high output capability.
Solution Approach 2:
The heat dissipation connection member acts as an intermediary component that thermally connects the heat dissipation pattern on the wiring board to the heat dissipation substrate. This intermediary structure enables effective heat transfer from the wiring board to the heat dissipation substrate, allowing heat generated by high power operation to be efficiently removed without compromising performance.
2Temperature
If heat dissipation is improved by adding thermal pathways, then temperature control is enhanced, but device structure becomes more complex
Solution Approach 1:
The heat dissipation substrate serves multiple functions: it acts as both the mounting substrate for the semiconductor package and the heat dissipation pathway. The wiring board also dual-functions as both the electrical connection substrate and carries the heat dissipation pattern. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby limiting structural complexity while improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation from the wiring board to the heat dissipation member, reducing the risk of overheating and improving the overall thermal management of the semiconductor device.
Implementation Method 1
The heat dissipation connection member is disposed between the heat dissipation pattern and the insulating heat dissipation substrate to thermally connect between the heat dissipation pattern and the insulating heat dissipation substrate
Implementation Method 2
a heat dissipation member is arranged on the other side of the semiconductor package. In such a semiconductor device, heat generated from the semiconductor package is dissipated from the heat dissipation member
Data Source
AI summary
A semiconductor device includes a wiring board having a wiring pattern, a semiconductor package, and a heat dissipation member. The semiconductor package includes a heat dissipation substrate, a semiconductor chip formed with a semiconductor element and arranged on the heat dissipation substrate, and an element pad electrically connected to the semiconductor chip. The semiconductor package is mounted on the wiring board, and the element pad is connected to the wiring pattern. The heat dissipation member is disposed opposite to the wiring board with respect to the semiconductor package, and is thermally connected to the insulating heat dissipation substrate. The wiring pattern includes a heat dissipation pattern that is connected to the semiconductor element and allows a current according to an operation of the semiconductor element to flow. A heat dissipation connection member is disposed between the heat dissipation pattern and the insulating heat dissipation substrate to thermally connect therebetween.