Semiconductor Package Thermal Patterns for Dense IC Heat Dissipation
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Solution Overview
Problem
As the integrated circuit (IC) industry continues to scale down, there is a need for more efficient thermal management solutions to handle the increasing heat generated by denser and more complex ICs.
Innovation Solution
The proposed solution involves forming a semiconductor package with thermal conductive patterns and an interposer, where the dies are bonded to a carrier with high thermal conductivity, and the thermal conductive patterns are formed to efficiently couple heat away from the dies to the carrier, which acts as a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If functional density is increased to improve production efficiency and lower costs, then productivity increases, but heat generation increases causing thermal management problems
Solution Approach 1:
The patent introduces thermal conductive patterns as intermediary elements between the dies and the carrier. These patterns act as thermal mediators that facilitate heat transfer from the heat-generating dies to the heat-sinking carrier, resolving the thermal management problem caused by increased functional density.
Solution Approach 2:
The patent extracts the thermal management function from the overall package structure by implementing dedicated thermal conductive patterns and utilizing the carrier as a heat sink. This separates the thermal dissipation pathway from the electrical interconnect structure, allowing independent optimization of both functions.
2Temperature
If additional heat sinks are added to improve thermal dissipation, then temperature control improves, but device complexity increases
Solution Approach 1:
The patent makes the carrier multi-functional by enabling it to serve both as a mechanical support structure and as a heat sink. The thermal conductive patterns on the carrier allow it to perform thermal management functions without requiring separate heat sink components, thereby reducing device complexity while maintaining effective temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively enhances thermal dissipation efficiency, reduces the need for additional heat sinks, and improves interconnect latency and speed, making it suitable for advanced applications like AI accelerators.
Implementation Method 1
the dies are bonded to a carrier with high thermal conductivity, and the thermal conductive patterns are formed to efficiently couple heat away from the dies to the carrier, which acts as a heat sink
Data Source
AI summary
A semiconductor package includes a die, a first thermal pattern and an interposer. The first thermal pattern is disposed aside the die. The interposer is bonded to the die and includes a substrate, a wiring structure between the substrate and the die and a second thermal pattern. The second thermal pattern is thermally coupled to the first thermal pattern.