Semiconductor Package Thermal Post Layout for Multi-Chip Heat Dissipation
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving compact size, improved thermal characteristics, and excellent electrical properties, particularly in efficiently managing heat dissipation across multiple integrated chips.
Innovation Solution
The semiconductor package incorporates a thermal radiation structure with a thermal radiation post and a thermal conductive pattern, positioned between semiconductor chips, to enhance thermal radiation efficiency. This structure allows for effective heat dissipation by overlapping with circuit regions on the third semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are integrated into a compact package, then device functionality and integration density are improved, but thermal dissipation becomes insufficient
Solution Approach 1:
The patent introduces a vertical thermal radiation structure (thermal radiation post extending in the thickness direction) between horizontally arranged semiconductor chips. This transforms the thermal management approach from planar to three-dimensional, allowing heat dissipation paths to extend vertically without increasing the package footprint, thus resolving the contradiction between compact integration and thermal dissipation.
Solution Approach 2:
The thermal radiation post acts as an intermediary structure between the semiconductor chips and the heat dissipation path. It provides a dedicated thermal conduction pathway that mediates heat transfer from the chips to the external environment, enabling improved thermal management while maintaining high integration density.
2Temperature
If thermal radiation structure is added between semiconductor chips, then thermal radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The thermal radiation structure is segmented into distinct functional components: a thermal radiation post for vertical heat conduction and a thermal conductive pattern for lateral heat distribution. This segmentation allows each component to be optimized independently and simplifies the manufacturing process by enabling separate formation steps, thus reducing overall structural complexity while maintaining thermal radiation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the thermal radiation structure significantly improves heat dissipation from the semiconductor chips, thereby enhancing the thermal radiation efficiency and maintaining excellent electrical properties, even in compact package designs.
Implementation Method 1
a thermal conductive pattern on the thermal radiation post, wherein a bottom surface of the third semiconductor chip is in contact with the thermal conductive pattern
Implementation Method 2
at least one thermal radiation structure on the first substrate and between the first semiconductor chip and the second semiconductor chip
Data Source
AI summary
A semiconductor package includes: a first substrate; a first semiconductor chip; a second semiconductor chip being spaced apart, in a first direction, from the first substrate, the first direction being parallel to a top surface of the first substrate; at least one thermal radiation structure on the first substrate and between the first semiconductor chip and the second semiconductor chip; and a third semiconductor chip on the first semiconductor chip, the second semiconductor chip, and the at least one thermal radiation structure, wherein the at least one thermal radiation structure includes: a thermal radiation post; and a thermal conductive pattern on the thermal radiation post, wherein a bottom surface of the third semiconductor chip is in contact with the thermal conductive pattern, and wherein the top surface of the first substrate is in contact with the thermal radiation post.