Semiconductor Package Thermal Contact Resistance Evaluation
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Solution Overview
Problem
Conventional methods for evaluating thermal contact resistance in semiconductor packages are complex and time-consuming, requiring measurement of internal and surface temperatures to calculate thermal resistance.
Innovation Solution
A semiconductor package design that includes a test electrode connected to a thermal interface material, allowing for the measurement of electrical resistance to determine thermal contact resistance between the thermal interface material and the semiconductor device and heat spreader, simplifying the evaluation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature measurement methods are used to evaluate thermal contact resistance, then measurement accuracy can be maintained, but evaluation complexity and time consumption increase significantly
Solution Approach 1:
The patent replaces the conventional thermal measurement system (temperature sensors, heat generation equipment, data acquisition systems) with an electrical measurement system. By using a test electrode to measure electrical resistance between the heat spreader and the semiconductor device, the evaluation process becomes simpler and faster while maintaining measurement accuracy, as electrical resistance correlates with thermal contact resistance at the interface.
Solution Approach 2:
The patent changes the measurement parameter from thermal properties (temperature difference, heat flow) to electrical properties (electrical resistance). This parameter substitution allows for a more straightforward evaluation method that reduces equipment complexity and measurement time while providing reliable assessment of thermal contact resistance at the interface between components.
2Measurement precision
If conventional temperature-based evaluation methods are employed, then thermal resistance can be calculated, but evaluation time is significantly extended
Solution Approach 1:
The patent substitutes the time-consuming thermal measurement process with a rapid electrical resistance measurement. The test electrode directly measures electrical resistance between the heat spreader and semiconductor device, providing immediate evaluation results without requiring temperature stabilization, heat generation, or complex data acquisition, thus dramatically reducing evaluation time while maintaining accuracy.
3Reliability
If thermal interface material is used to reduce thermal contact resistance, then heat conduction efficiency improves, but the complexity of ensuring proper contact increases
Solution Approach 1:
The patent introduces a thermal interface material as an intermediary substance between the heat spreader and the semiconductor device. This material fills surface irregularities and ensures intimate thermal contact between the two components, thereby reducing thermal contact resistance and improving heat conduction efficiency while simplifying the contact interface requirements.
Solution Approach 2:
The patent uses electrical resistance measurement as an intermediary indicator to assess the quality of thermal contact. Instead of directly measuring complex thermal properties, the electrical resistance between components serves as a proxy that correlates with thermal contact resistance, simplifying the verification process for thermal interface material performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a straightforward and efficient evaluation of thermal contact resistance, reducing evaluation time and improving the quality of semiconductor packages by ensuring effective thermal interface material performance.
Implementation Method 1
heat generated by a semiconductor device 200 mounted on a board 100 is transferred to a heat spreader 400 via a thermal interface material 300a provided on the semiconductor device 200
Implementation Method 2
measuring an electrical resistance of a part of the semiconductor package from a heat spreader through a test electrode via a thermal interface material provided on the semiconductor device
Data Source
AI summary
A semiconductor package includes a wiring board, a semiconductor device mounted on the wiring board, an electrically-conductive thermal interface material provided on the semiconductor device, a test electrode in contact with a first surface of the thermal interface material to be electrically connected to the thermal interface material, and an electrically-conductive heat spreader in contact with a second surface of the thermal interface material opposite to its first surface.