Semiconductor Package Thermal Spreader Layout for Stacked Heat Dissipation
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Solution Overview
Problem
Existing semiconductor package structures face challenges with thermal dissipation, particularly in stacked configurations, which affects performance due to limited projection area resources.
Innovation Solution
Incorporating a thermal spreader with higher thermal conductivity than the semiconductor dies, positioned adjacent to or overlapping with the dies, and bonded through an adhesion layer, which also serves as a thermal dissipation path, enhancing heat transfer and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor package structures are stacked vertically to reduce area, then area utilization is improved, but thermal dissipation deteriorates
Solution Approach 1:
The patent introduces a thermal spreader component that extends in the vertical dimension (z-direction) beyond the top surface of the semiconductor die. This dimensional extension allows heat to dissipate into the third dimension through the molding compound, rather than being constrained to lateral dissipation only, thereby resolving the thermal dissipation problem caused by vertical stacking.
Solution Approach 2:
The thermal spreader acts as an intermediary component between the semiconductor die and the external environment. It has higher thermal conductivity than the molding compound and provides an intermediate heat transfer path, facilitating efficient heat removal from the die while maintaining the compact stacked package structure.
2Temperature
If thermal spreader projection area is increased to improve thermal dissipation, then thermal dissipation is improved, but device complexity increases
Solution Approach 1:
The thermal spreader is designed to serve multiple functions: it provides thermal dissipation through its extended projection area, mechanically supports the semiconductor die, and creates cavities for molding compound infiltration. By combining these functions into a single component, the patent improves thermal dissipation without proportionally increasing device complexity.
Solution Approach 2:
The thermal spreader's extended portion is positioned within the molding compound, creating a nested configuration where the thermal spreader is embedded in the molding material. This nesting allows the thermal spreader to extend its heat dissipation function without adding external structural complexity to the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves thermal dissipation efficiency, thereby enhancing the performance of semiconductor package structures by increasing the thermal spreader's projection area and utilizing redistribution layers as additional dissipation paths.
Implementation Method 1
Incorporating a thermal spreader with higher thermal conductivity than the semiconductor dies, positioned adjacent to or overlapping with the dies
Data Source
AI summary
A semiconductor package structure includes a first redistribution layer, a first semiconductor die, a second semiconductor die, a thermal spreader, a molding material, and a second redistribution layer. The first semiconductor die and the second semiconductor die are disposed side-by-side over the first redistribution layer. The thermal spreader vertically overlaps with the first semiconductor die and/or the second semiconductor die. The molding material surrounds the thermal spreader, the first semiconductor die and the second semiconductor die. The second redistribution layer is disposed over the molding material.