Semiconductor Package Thermal Stack for Vertical Heat Dissipation
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Solution Overview
Problem
As semiconductor packages increase in speed and capacity, their power consumption also increases, leading to thermal management challenges that affect their performance and reliability.
Innovation Solution
A semiconductor package system with a heat dissipation structure that includes a substrate, semiconductor packages, passive elements, and heat conduction layers, where the height of the semiconductor packages and heat conduction layers are strategically designed to enhance thermal conductivity and dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor packages increase in speed and capacity, then processing power and functionality are improved, but power consumption increases leading to thermal management challenges
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional vertical heat dissipation by stacking semiconductor packages with heat dissipation structures extending upward. Multiple heat conduction layers are arranged vertically at different heights, creating a multi-layer thermal management architecture that dissipates heat in the vertical dimension rather than relying solely on horizontal spreading.
Solution Approach 2:
The heat dissipation system is divided into multiple independent heat conduction layers positioned at different vertical levels. Each heat conduction layer is selectively connected to specific semiconductor packages based on their thermal requirements, allowing segmented and targeted heat dissipation for different components rather than a unified approach.
2Temperature
If a heat dissipation structure is added to manage thermal characteristics, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat dissipation structure serves multiple functions simultaneously: it provides thermal management for different semiconductor packages, acts as a mechanical support structure, and enables electrical connections through the vertical stack. The same structural elements perform both thermal conduction and structural support roles, reducing the need for separate dedicated components.
Solution Approach 2:
Multiple functional elements are merged into a single integrated heat dissipation structure. The heat conduction layers are combined with the packaging structure itself rather than being separate add-on components. The support posts and heat dissipation pathways are integrated into a unified vertical architecture that accomplishes multiple objectives simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat generated by high-power semiconductor packages, improving operating characteristics and reliability by ensuring quick heat transfer to the heat dissipation structure.
Implementation Method 1
a first heat conduction layer between the first semiconductor package and the heat dissipation structure
Data Source
AI summary
Provided is a semiconductor package system. The system includes a substrate, a first semiconductor package on the substrate, a second semiconductor package on the substrate, a first passive element on the substrate, a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the first passive element, and a first heat conduction layer between the first semiconductor package and the heat dissipation structure. A sum of a height of the first semiconductor package and a thickness of the first heat conduction layer may be greater than a height of the first passive element. The height of the first semiconductor package may be greater than a height of the second semiconductor package.