Semiconductor Package Trenches for Lower Thermal Resistance
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Solution Overview
Problem
Current semiconductor package structures are inadequate for managing the increasing thermal energy generated by advanced semiconductor devices, leading to performance and reliability issues.
Innovation Solution
A thermally advanced semiconductor package design featuring trenches and a conductive shielding layer that enhances thermal dissipation, combined with various cooling methods such as immersion cooling and liquid circulation, to efficiently manage thermal energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional semiconductor package structures are used, then manufacturing simplicity is maintained, but thermal management capability becomes insufficient
Solution Approach 1:
The package structure is segmented into multiple functional layers including a substrate, a thermal management layer with trenches, and a conductive shielding layer. This segmentation allows each layer to perform its specific function optimally while collectively solving the thermal management problem.
Solution Approach 2:
A thermal interface material is introduced as an intermediary between the semiconductor die and the thermal management layer. This intermediary enhances thermal transfer efficiency and fills the trenches to create direct thermal pathways from the heat-generating components to the cooling structures.
2Loss of energy
If advanced cooling methods are integrated, then thermal dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
Multiple functions are merged into a single integrated thermal management layer that combines trench structures for thermal pathways, conductive shielding for electromagnetic interference protection, and thermal interface material application. This merging reduces the number of separate components and simplifies the manufacturing process.
Solution Approach 2:
The thermal management layer serves multiple functions simultaneously: it provides thermal pathways through trenches, offers electromagnetic shielding through conductive material, and acts as a structural support layer. This multi-functionality reduces overall package complexity while improving thermal dissipation.
3Reliability
If thermal resistance is reduced through advanced structures, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The thermal management structure extends into the vertical dimension with trenches penetrating through the substrate thickness. This dimensional approach creates direct thermal pathways from the die interface through the substrate to the bottom surface, significantly reducing thermal resistance by providing a short thermal conduction path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces thermal resistance and increases thermal conductivity, ensuring efficient cooling and improved performance and reliability of semiconductor devices.
Implementation Method 1
A thermally advanced semiconductor package design featuring trenches and a conductive shielding layer that enhances thermal dissipation
Implementation Method 2
various cooling methods such as immersion cooling and liquid circulation
Implementation Method 3
immersion cooling
Data Source
AI summary
A semiconductor device includes a substrate. A semiconductor die is disposed over the substrate. An encapsulant is deposited over the substrate and semiconductor die. A first trench is formed in the encapsulant over the semiconductor die. A conductive layer is formed over the encapsulant and into the first trench.