Semiconductor Package Thermal Via Heat Dissipation
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Solution Overview
Problem
Package-on-package (PoP) semiconductor devices face challenges in heat dissipation, leading to device malfunctions and reduced operation speed due to their large thickness and inefficient heat exhaustion.
Innovation Solution
A semiconductor package design that includes a lower and upper package substrate with heat-dissipation patterns and vias, where the lower semiconductor chip has heat-conducting vias connected to the upper heat-dissipation pattern, allowing for effective heat dissipation through a thermal pathway.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If package-on-package structure is used to achieve high integration, then device functionality is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a vertical thermal conduction pathway through heat-conducting vias that extend from the lower semiconductor chip through the upper semiconductor chip to the heat-dissipation pattern on the upper package substrate. This three-dimensional thermal management approach enables heat to be conducted vertically across multiple layers, resolving the heat dissipation problem in the package-on-package structure while maintaining high integration.
Solution Approach 2:
The patent introduces heat-conducting vias as intermediary thermal conduction channels between the lower semiconductor chip and the heat-dissipation pattern. These vias act as thermal mediators that bridge the thermal gap created by the stacked package structure, enabling efficient heat transfer from the heat-generating lower chip through the upper chip to the external heat-dissipation pattern.
2Adaptability or versatility
If package thickness is increased to accommodate multiple chips, then integration density is improved, but heat exhaustion efficiency deteriorates
Solution Approach 1:
The patent establishes a vertical thermal conduction pathway through heat-conducting vias that extend from the lower semiconductor chip through the upper semiconductor chip to the heat-dissipation pattern on the upper package substrate. This three-dimensional thermal management approach enables heat to be conducted vertically across multiple layers, resolving the heat dissipation problem in the package-on-package structure while maintaining high integration.
Solution Approach 2:
The patent segments the thermal conduction path into multiple distinct components: heat-conducting vias within the lower chip, heat-conducting vias within the upper chip, and the heat-dissipation pattern on the package substrate. This segmentation allows each component to be optimized for its specific thermal conduction function, improving overall heat exhaustion efficiency despite increased package thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation from the lower semiconductor chip, improving the thermal properties of the package and preventing malfunctions, thereby maintaining operation speed and efficiency.
Implementation Method 1
the first via may provide a pathway for dissipating heat generated in the lower semiconductor chip
Implementation Method 2
an upper heat-dissipation pattern... providing a pathway for dissipating heat generated in the lower semiconductor chip
Data Source
AI summary
A semiconductor package is provided. The semiconductor package include a lower semiconductor package including a lower package substrate and a lower semiconductor chip mounted thereon, and an upper semiconductor package provided on the lower semiconductor package to include an upper package substrate and an upper semiconductor chip mounted thereon. The upper package substrate include an upper heat-dissipation pattern, the lower semiconductor chip include a first via connected to the upper heat-dissipation pattern through the lower semiconductor chip, and the first via may provide a pathway for dissipating heat generated in the lower semiconductor chip.