Semiconductor Package Thermal Via and Rear Surface Pads
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packages face challenges in achieving high integration and high-speed performance while effectively managing heat dissipation and signal transmission in stacked chip configurations.
Innovation Solution
The semiconductor package design includes stacked semiconductor chips with a lower chip featuring via electrodes and signal/thermal pads, and an upper chip with a wiring structure and vias connected by signal and thermal bumps, allowing for efficient heat dissipation and signal transmission between chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor chips are stacked vertically to achieve high integration, then the integration density is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces dedicated thermal via holes extending through the substrate thickness direction (vertical dimension) and thermal pads on the rear surface, creating a three-dimensional heat dissipation pathway. This moves heat management from a two-dimensional surface problem to a three-dimensional volumetric solution, allowing heat to be conducted vertically through the substrate and dissipated at the rear surface, thereby resolving the heat dissipation difficulty in vertically stacked high-integration packages.
2Productivity
If more via electrodes and wiring structures are added to increase signal transmission capacity, then the signal transmission capability is improved, but the manufacturing complexity increases
Solution Approach 1:
The substrate serves multiple functions simultaneously: it provides mechanical support, contains signal transmission pathways (via holes and wiring layers), and acts as a thermal management system (thermal via holes and thermal pads). By integrating signal and thermal management functions into a single multi-functional substrate structure, the patent reduces the need for separate components and assembly steps, thereby decreasing manufacturing complexity while maintaining high signal transmission capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and operational stability of semiconductor packages by enabling effective heat transfer and signal connectivity between stacked chips, addressing the limitations of existing technologies.
Implementation Method 1
entire bottom surfaces of the plurality of rear surface thermal pads may in contact with the rear surface protecting layer
Implementation Method 2
a plurality of thermal bumps connecting between the plurality of rear surface thermal pads and the plurality of thermal vias
Data Source
AI summary
Provided is a semiconductor package including a lower semiconductor chip including a lower semiconductor substrate, a rear surface protecting layer covering a non-active surface of the lower semiconductor substrate, a plurality of lower via electrodes, and a plurality of rear surface signal pads and a plurality of rear surface thermal pads arranged on the rear surface protecting layer; an upper semiconductor chip including an upper semiconductor substrate, a wiring structure on an active surface of the upper semiconductor substrate, a front surface protecting layer that covers the wiring structure and has a plurality of front surface openings, and a plurality of signal vias and a plurality of thermal vias that fill the front surface openings; and a plurality of signal bumps connecting between the rear surface signal pads and the signal vias and a plurality of thermal bumps connecting between the rear surface thermal pads and the thermal vias.