Semiconductor Package Thermoelectrics for Heat Recovery and Cooling
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Solution Overview
Problem
As semiconductor components become increasingly integrated, heat dissipation becomes a significant challenge, affecting thermal stability and efficiency.
Innovation Solution
Integration of thermoelectric (TE) components as both thermoelectric generators (TEGs) and thermoelectric coolers (TECs) within semiconductor packages to manage heat dissipation and temperature control, utilizing the Seebeck and Peltier effects for power generation and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If minimum feature size is reduced to increase integration density, then more components can be integrated into a given area, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from two-dimensional planar heat dissipation to three-dimensional vertical heat dissipation by extending heat dissipation fins upward from the substrate surface, creating a multi-layered thermal management structure that addresses heat dissipation challenges in high-density integrated circuits
Solution Approach 2:
The patent employs a foam-like substrate structure with porous characteristics that provides both mechanical support and enhanced thermal conduction pathways, allowing heat to be efficiently transported from dense circuit regions to the heat dissipation fins while maintaining structural integrity
2Productivity
If integration density is increased, then more components are packed into a given area, but thermal stability deteriorates
Solution Approach 1:
The patent divides the heat dissipation function into multiple separate fins distributed across the substrate surface, with each fin serving as an independent heat dissipation element that can be optimized for specific thermal loads from underlying circuit components
Solution Approach 2:
The patent utilizes a composite structure combining a foam-like substrate material with integrated heat dissipation fins, where the substrate provides mechanical support and the fins provide specialized thermal management functionality, creating a multi-material system that addresses both structural and thermal requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management by generating electrical power from waste heat, reducing energy consumption, and maintaining temperature stability, thereby improving the reliability and efficiency of semiconductor operations.
Implementation Method 1
utilizing the Seebeck and Peltier effects for power generation and heat transfer
Implementation Method 2
utilizing the Seebeck and Peltier effects for power generation and heat transfer
Data Source
AI summary
A method includes forming a first thermoelectric component on a first die; forming a second thermoelectric component on a second die; and connecting the first die and the second die to an interposer, wherein connecting the first die and the second die to the interposer electrically couples the first thermoelectric component and the second thermoelectric component to the interposer.