Semiconductor Package Through-Electrode Insulation Layer Design
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Solution Overview
Problem
Conventional semiconductor packages with through-electrodes experience signal loss and capacitance issues due to insulation layers acting as capacitors, which hinder high-speed operation and miniaturization efforts.
Innovation Solution
The semiconductor package design incorporates through-holes with insulation layers of varying thicknesses or dielectric constants in different regions to optimize capacitance for signal and power transmission, with thicker or lower dielectric constant insulation layers in specific regions to reduce signal loss and enhance transmission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation layers are formed between through-holes and through-electrodes, then current leakage is prevented, but capacitance increases causing signal loss and degraded high-speed operation
Solution Approach 1:
The patent applies local quality by forming insulation layers selectively only in specific regions around through-electrodes, rather than uniformly throughout. The insulation layers are positioned in regions where current leakage prevention is critical, while leaving other regions without insulation layers to minimize capacitance and reduce signal loss, thus resolving the contradiction between reliability and energy loss.
Solution Approach 2:
The patent segments the insulation layer formation into distinct regions: regions where insulation layers are formed to prevent current leakage, and regions where they are omitted to reduce capacitance. This segmentation allows the structure to simultaneously achieve both current leakage prevention and minimized signal loss by treating different spatial zones differently.
2Reliability
If insulation layers are formed between through-holes and through-electrodes, then current leakage is prevented, but high-speed operation is hindered due to capacitive effects
Solution Approach 1:
The patent applies local quality by forming insulation layers selectively only in specific regions around through-electrodes, rather than uniformly throughout. The insulation layers are positioned in regions where current leakage prevention is critical, while leaving other regions without insulation layers to minimize capacitance and reduce signal loss, thus resolving the contradiction between reliability and energy loss.
Solution Approach 2:
The patent segments the insulation layer formation into distinct regions: regions where insulation layers are formed to prevent current leakage, and regions where they are omitted to reduce capacitance. This segmentation allows the structure to simultaneously achieve both current leakage prevention and minimized signal loss by treating different spatial zones differently.
3Ease of manufacture
If conventional through-electrodes with uniform insulation layers are used, then manufacturing is simplified, but transmission characteristics for both signals and power cannot be optimized simultaneously
Solution Approach 1:
The patent applies local quality by forming insulation layers selectively only in specific regions around through-electrodes, rather than uniformly throughout. The insulation layers are positioned in regions where current leakage prevention is critical, while leaving other regions without insulation layers to minimize capacitance and reduce signal loss, thus resolving the contradiction between reliability and energy loss.
Solution Approach 2:
The patent segments the insulation layer formation into distinct regions: regions where insulation layers are formed to prevent current leakage, and regions where they are omitted to reduce capacitance. This segmentation allows the structure to simultaneously achieve both current leakage prevention and minimized signal loss by treating different spatial zones differently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves signal transmission efficiency by minimizing capacitance in signal-transmitting regions and maximizes power transmission efficiency by adjusting insulation layer properties, thereby addressing the limitations of conventional stack packages.
Implementation Method 1
the insulation layers serve as capacitors due to their arrangement between the portions of the semiconductor chips and the through-electrodes
Implementation Method 2
insulation layers of varying thicknesses or dielectric constants in different regions
Data Source
AI summary
A semiconductor package includes a semiconductor chip having a first region and a second region. Bonding pads are formed and through-holes are defined in the first and second regions. Insulation layers are formed on sidewalls of the through-holes, and through-electrodes formed in the through-holes and connected with corresponding bonding pads. The insulation layers formed in the first and second regions have different thicknesses or dielectric constants.