Semiconductor Package Through-Hole Heat Dissipation
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Solution Overview
Problem
As semiconductor packages become slimmer, lighter, and more compact, they face challenges with heat dissipation and electromagnetic interference (EMI) shielding due to miniaturization, leading to reliability issues and degraded device characteristics.
Innovation Solution
A semiconductor package design featuring a frame with a through hole, an electronic component, a metal layer on the frame and component, a redistribution portion, and a conductive layer that connects the metal layer to a ground electrode, improving heat dissipation and EMI shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor packages are made slimmer and more compact, then device size is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a through-hole structure that extends vertically through the package, creating a three-dimensional heat dissipation pathway. This allows heat to be conducted from the electronic component through the conductive layer in the through-hole to the heat dissipation structure, effectively adding a vertical dimension to heat transfer in an otherwise compact horizontal package footprint.
Solution Approach 2:
The patent introduces a conductive layer as an intermediary substance filling the through-hole, which mediates heat transfer between the electronic component and the heat dissipation structure. This conductive layer enables efficient thermal conduction through the package while maintaining a compact overall size.
2Volume of moving object
If semiconductor packages are made slimmer and more compact, then device size is reduced, but EMI shielding performance deteriorates
Solution Approach 1:
The through-hole structure with conductive layer and heat dissipation structure creates a three-dimensional EMI shielding configuration. The conductive layer and heat dissipation structure form shielding barriers that extend vertically, providing effective EMI protection within a compact horizontal footprint by utilizing the vertical dimension.
Solution Approach 2:
The heat dissipation structure serves multiple functions: it provides thermal conduction for heat dissipation, acts as an EMI shielding barrier, and contributes to the overall structural integrity of the package. This multi-functionality allows simultaneous improvement of both heat dissipation and EMI shielding performance without increasing package size.
3Reliability
If complex EMI shielding and heat dissipation structures are added, then performance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the heat dissipation function and EMI shielding function into a single integrated structure. The heat dissipation structure simultaneously performs thermal conduction and electromagnetic shielding, eliminating the need for separate components and simplifying the manufacturing process while maintaining performance.
Solution Approach 2:
The conductive layer in the through-hole serves dual purposes: facilitating heat conduction and providing EMI shielding. This multi-functionality reduces the number of separate components needed, thereby simplifying the overall structure and manufacturing process while achieving both heat dissipation and EMI shielding performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation efficiency and EMI shielding properties, addressing the reliability and performance issues caused by miniaturization while reducing manufacturing costs and improving yield.
Implementation Method 1
a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component
Implementation Method 2
a conductive layer connected to the metal layer
Data Source
AI summary
A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and the electronic component, and a conductive layer connected to the metal layer.