Semiconductor Package With Through-Hole Passive Components
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Solution Overview
Problem
The increasing size of mobile device batteries necessitates a reduction in printed circuit board size, leading to reduced component mounting area, which results in increased electromagnetic interference (EMI) and electrical noise due to the large distance between semiconductor chips and passive components in existing COB technology.
Innovation Solution
A semiconductor package design featuring a support member with through-holes and a wiring structure connecting opposing surfaces, a connection member with redistribution layers, and encapsulants to minimize spatial consumption and reduce EMI by closely packing semiconductor chips and passive components, while maintaining effective electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If COB technology is used to mount components on a printed circuit board, then the component mounting area can be maintained, but the distance between semiconductor chip and passive components becomes large, resulting in increased electrical noise and electromagnetic interference
Solution Approach 1:
The patent embeds passive components inside through-holes of the support member, creating a nested structure where components are housed within the support member's internal cavities. This nesting approach reduces the horizontal distance between semiconductor chip and passive components from millimeter-level (in COB) to micrometer-level (within through-holes), significantly reducing electrical noise while maintaining compact footprint.
Solution Approach 2:
The patent transitions from planar mounting (COB technology where components are mounted on the surface) to three-dimensional arrangement by placing passive components inside through-holes that extend vertically through the support member. This vertical dimensionality change allows components to be positioned much closer in 3D space while maintaining adequate horizontal spacing on the PCB.
2Object-affected harmful factors
If the distance between semiconductor chip and passive components is reduced to minimize EMI, then electrical noise is reduced, but the spatial consumption and device size increase
Solution Approach 1:
By nesting passive components within the through-holes of the support member, the patent achieves close proximity for EMI reduction without increasing the external footprint of the device. The support member's through-holes provide internal storage space that would otherwise be empty, utilizing vertical space efficiently.
Solution Approach 2:
The support member acts as a thin-film structure with through-holes that provides both mechanical support and component housing. This thin-film approach allows the structure to maintain minimal thickness while providing sufficient internal volume within through-holes to accommodate passive components, thus reducing overall device volume.
3Ease of manufacture
If passive components are mounted on the printed circuit board surface, then the manufacturing process is simple, but the mounted area is large and electromagnetic interference is significant
Solution Approach 1:
The patent segments the mounting structure into distinct functional zones: the support member with through-holes for passive components, the connection member for electrical interconnection, and the semiconductor chip mounting area. This segmentation allows each component to be positioned optimally within its designated zone, reducing overall mounted area while maintaining manufacturing feasibility through standardized assembly processes.
Solution Approach 2:
The support member serves as an intermediary structure between the printed circuit board and the passive components. Instead of mounting components directly on the PCB surface, the support member provides a structured platform with integrated through-holes, simplifying the manufacturing process while reducing mounted area through vertical component placement.
Data Source
AI summary
A semiconductor package includes a support member having first and second surfaces opposing each other, having first and second through-holes, spaced apart from each other, and having a wiring structure that connects the first and second surfaces to each other; a connection member disposed on the second surface of the support member and having redistribution layers connected to the wiring structure; a semiconductor chip disposed in the first through-hole and having connection pads connected to the redistribution layers; a second passive component disposed in the second through-hole and connected to the redistribution layers; a first encapsulant disposed on the first surface of the support member and encapsulating the first passive component; and a second encapsulant encapsulating the support member, the first encapsulant, and the semiconductor chip.