Semiconductor Package Through-Wiring Direct Wiring Layer Connection
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Solution Overview
Problem
Conventional semiconductor packages with via-holes face limitations in reducing package size and selecting insulating materials due to the need for thick first insulating layers and the presence of additional metal pads, which restricts fine pitch patterning and increases thickness.
Innovation Solution
A semiconductor package design that eliminates the need for additional metal pads by directly connecting through-wiring to the wiring layer, allowing for a slim and lightweight structure with a thin insulating layer, and includes a through-wiring that extends from the substrate's inner surface, enabling coplanar or slightly protruding ends, and uses a conductive or non-conductive through member to facilitate electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal pad is formed on the upper surface of the substrate to connect the pad of the semiconductor chip with the via-hole, then electrical connection is achieved, but the first insulating layer must be coated more thickly to uniformly cover the metal pad, limiting insulating material selection and fine pitch patterning
Solution Approach 1:
The invention extracts and eliminates the metal pad component from the conventional structure. Instead of forming a metal pad on the upper surface of the substrate, the through-wiring directly extends from the inner circumferential surface of the via-hole to connect with the wiring layer, removing the source of the thickness problem while maintaining electrical connection functionality
Solution Approach 2:
The invention merges the function of the metal pad and the through-wiring into a single integrated structure. The through-wiring directly connects the via-hole to the wiring layer without requiring a separate metal pad, combining multiple functions into one component and simplifying the overall structure
2Reliability
If a thick first insulating layer is coated to uniformly cover the metal pad, then uniform insulation is achieved, but the selection of insulating materials is limited and fine pitch patterning faces limitations
Solution Approach 1:
By removing the metal pad that caused the thickness issue, the invention enables the use of thinner insulating layers. This extraction allows for greater versatility in insulating material selection and enables fine pitch patterning that would be impossible with thick insulating layers
3Reliability
If additional metal pads and thick insulating layers are used to ensure electrical connection, then connection reliability is improved, but the total package thickness increases
Solution Approach 1:
The invention extracts the unnecessary metal pad and thick insulating layer components, directly connecting the through-wiring to the wiring layer. This elimination of redundant components significantly reduces the total package thickness while maintaining reliable electrical connection
Solution Approach 2:
By merging the connection functions into a single through-wiring structure that directly connects to the wiring layer, the invention eliminates the need for separate metal pads and thick insulating layers, achieving both connection reliability and thin profile
Data Source
AI summary
Disclosed herein are a semiconductor package and a method of manufacturing the same, which allows a conductive path to be provided to connect upper and lower portions of the semiconductor package. A semiconductor package according to the present invention includes a semiconductor chip, a substrate including an accommodating portion to accommodate the semiconductor chip, a sealing material configured to mold the semiconductor chip and the substrate to be integrated, a through wiring configured to vertically pass through the substrate, a wiring portion configured to electrically connect the semiconductor chip and one side of the through wiring, and an external connection portion to electrically connected to the other side of the through wiring and configured to be able to be electrically connected to an outside, wherein a wiring layer of the wiring portion is provided to be connected to the through wiring.