Semiconductor Package Through Wiring via Preliminary Substrate Drilling
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Solution Overview
Problem
Conventional semiconductor package manufacturing processes face challenges in forming precise through holes and achieving low process defects, particularly due to damage to chip pads and penetration of molding materials, which complicates the formation and filling of through patterns.
Innovation Solution
The semiconductor package design includes an insulating substrate with through portions, through wiring that penetrates the substrate, a semiconductor chip electrically connected to the wiring, and a re-wiring pattern layer that connects the chip to the wiring, with a protective layer and controlled thicknesses to reduce defects and signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a through hole is formed in the outer molding region of the semiconductor chip to connect electrical signals vertically, then electrical connection is achieved, but damage to chip pad surface and penetration of molding material occurs
Solution Approach 1:
The patent applies preliminary action by forming the through hole in the molding region before mounting the semiconductor chip. This sequence prevents damage to the chip pad surface because the hole formation process occurs on the molding substrate rather than on the chip itself, eliminating the harmful effect of pad damage while maintaining electrical connection functionality
2Reliability
If a through hole is formed in the outer molding region, then vertical electrical connection is achieved, but penetration of molding material occurs
Solution Approach 1:
The patent performs the hole formation action preliminarily on the molding substrate before chip mounting. By establishing the through hole structure in advance on the substrate rather than attempting to form it after chip placement, the method prevents molding material penetration issues while achieving reliable vertical electrical connection through the molding region
3Manufacturing precision
If the through hole is formed to densely fill with conductive material, then manufacturing precision is improved, but process complexity increases
Solution Approach 1:
The patent applies preliminary action by forming and preparing the through hole structure on the molding substrate before chip mounting. This advance preparation allows for precise hole formation and conductive material filling to be performed on the substrate in a controlled manner, achieving high manufacturing precision while managing process complexity through sequential fabrication steps
Data Source
AI summary
Provided is a method of manufacturing a semiconductor package including a through wiring having precision and a low process defect. The semiconductor package includes an insulating substrate including a first through portion and a second through portion; a through wiring which fills the first through portion, and is located to penetrate the insulating substrate; a semiconductor chip which is located in the second through portion, and is electrically connected to the through wiring; a molding member molding the semiconductor chip and the insulating substrate; and a re-wiring pattern layer which is located at a lower side of the insulating substrate, and electrically connects the through wiring and the semiconductor chip.