Semiconductor Package Structure for Heat Dissipation and Tilt Adjustment
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Solution Overview
Problem
Existing semiconductor device configurations face challenges in achieving effective heat dissipation and accurate tilting adjustment, with complex manufacturing processes and insufficient heat dissipation properties due to limited heat dissipation surfaces and complicated bonding processes.
Innovation Solution
A semiconductor device design featuring metal parts on both substrate sides, thermally connected through a connection part, with a frame-shaped second metal part and resin part, and a transparent member forming a closed cavity to enhance heat dissipation and simplify tilting adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation parts are extended from the island main body to the container surface, then heat dissipation property is improved, but the manufacturing process becomes complicated due to bending requirements
Solution Approach 1:
The patent transitions from a two-dimensional heat dissipation approach (extending parts on the same plane) to a three-dimensional structure by positioning the second metal part on the opposite side of the substrate. This vertical arrangement eliminates the need for bending operations while maintaining effective heat dissipation pathways through the substrate thickness direction.
Solution Approach 2:
The heat dissipation function is segmented into multiple independent metal parts (first metal part on one side, second metal part on the other side) connected through the substrate. This segmentation allows each part to be positioned and manufactured independently without requiring complex bending or forming operations.
2Manufacturing precision
If contact parts for positioning are bonded to the package main body, then positioning accuracy is improved, but the manufacturing time and process complexity increase
Solution Approach 1:
The positioning function is merged into the frame-shaped second metal part itself, which serves dual purposes: providing structural support for heat dissipation and enabling positioning through its inherent geometric features. This eliminates the need for separate bonding operations of contact parts.
Solution Approach 2:
The second metal part is designed with multi-functionality, serving both as a heat dissipation component and as a positioning element through its frame structure. This universal design reduces the total number of manufacturing steps by combining multiple functions into a single component.
3Stability of the object's composition
If a lid body is disposed through a frame plate on the bottom plate, then package structure is formed, but heat dissipation property becomes insufficient
Solution Approach 1:
The patent employs composite construction with multiple metal parts (first metal part, second metal part) connected through the substrate, creating a hybrid thermal management system. This composite structure provides both structural integrity and enhanced heat dissipation capabilities compared to single-material designs.
Solution Approach 2:
The heat dissipation structure extends in the vertical dimension by placing the second metal part on the opposite side of the substrate from the first metal part. This three-dimensional arrangement increases the heat dissipation surface area and creates multiple thermal pathways without compromising the package's structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved heat dissipation and accurate tilting adjustment with a simple configuration, ensuring a high heat dissipation property and efficient thermal management while reducing manufacturing complexity.
Implementation Method 1
a connection part that is a metal part connecting the first metal part and the second metal part to each other
Data Source
AI summary
In a semiconductor device, a good heat dissipation property can be acquired using a simple configuration, and adjustment of tilting of the semiconductor element can be easily performed with high accuracy. A semiconductor device includes: a substrate; a first metal part configured to be disposed on one plate face side of the substrate; a semiconductor element configured to be disposed in a state of being fixed to the first metal part and electrically connected to the substrate; a second metal part configured to be disposed on the other plate face side of the substrate; and a connection part that is a metal part connecting the first metal part and the second metal part to each other.