Semiconductor Package Top Surface Heat Dissipation
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Solution Overview
Problem
Modern semiconductor packages face challenges in heat dissipation due to their smaller size and increased heat generation, as conventional heat reduction methods, such as additional heat sinks, compromise the overall form factor and are not feasible in constrained spaces like mobile devices.
Innovation Solution
The semiconductor package incorporates a thermally conductive encapsulant, exposed semiconductor devices or terminals, and a cap structure made of thermally conductive materials, along with a thermally conductive epoxy or solder paste, to facilitate heat dissipation through the top surface, while maintaining electrical safety and accommodating space constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If additional interior and/or exterior heat sinks are included to dissipate heat, then heat dissipation performance is improved, but the overall form factor of the package increases
Solution Approach 1:
The patent merges the heat dissipation function with existing package components (terminals, semiconductor device, encapsulant) rather than adding separate heat sinks. The terminals are configured to expose portions at the top surface for heat dissipation, and the encapsulant is made thermally conductive, combining structural and thermal management functions into single elements.
Solution Approach 2:
Existing package components are given multiple functions: the terminals serve both electrical connection and heat dissipation purposes through their exposed top surface portions; the encapsulant provides both mechanical protection and thermal conduction; the semiconductor device structure itself is utilized for heat path creation, eliminating the need for dedicated heat dissipation components.
2Volume of moving object
If the package size is reduced to meet form factor constraints, then the form factor is improved, but the ability to dissipate heat deteriorates due to reduced exterior surface area
Solution Approach 1:
The patent utilizes the top surface dimension of the package for heat dissipation by exposing portions of terminals and the semiconductor device at the top surface. This creates additional heat dissipation pathways in the vertical dimension rather than relying solely on lateral surface area, enabling effective heat dissipation in compact packages.
Solution Approach 2:
The patent creates localized heat dissipation regions at the top surface through exposed terminal portions and the exposed semiconductor device. The thermally conductive encapsulant concentrates thermal pathways in specific regions, allowing efficient heat dissipation from hot spots without requiring the entire package surface to be optimized for thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively dissipates heat from the package via multiple routes, enhancing thermal performance without compromising the form factor, thus improving semiconductor reliability and performance in compact applications.
Implementation Method 1
a thermally conductive epoxy or solder paste, to facilitate heat dissipation through the top surface
Implementation Method 2
The semiconductor package is configured to dissipate heat through a top surface of the package
Data Source
AI summary
A semiconductor package includes an encapsulant, a semiconductor device within the encapsulant, and one or more terminals for electrically coupling the semiconductor device to a node exterior to the package. The package further includes bonding means coupling the semiconductor device to the one or more terminals. The semiconductor package is configured to dissipate heat through a top surface of the package. To directly dissipate heat via the top surface of the package, a thermally conductive layer is coupled to the semiconductor device, and the layer is exposed at a surface of the package.