Semiconductor Package Structure with Side-by-Side Transducers and RDL
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Solution Overview
Problem
The challenge in semiconductor packaging is to achieve efficient electrical connections between integrated electronic devices while minimizing the thickness of the final product, which is crucial for improved performance and functionality.
Innovation Solution
A semiconductor package structure is developed, comprising transducer devices with transducing regions, a cap structure, redistribution layers (RDL), and protection material, where transducer devices are disposed side by side, and the RDL electrically connects them, with the cap structure forming an enclosed space to protect the transducing regions and reduce overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple electronic devices are integrated together to form a module, then electrical connection efficiency is improved, but package thickness increases
Solution Approach 1:
The patent transitions from vertical stacking to horizontal arrangement of transducer devices within a planar module configuration. Multiple transducer devices are disposed side by side on a substrate, with redistribution layers routing electrical connections in the plane rather than requiring vertical through-holes, thereby improving connection efficiency without increasing thickness
Solution Approach 2:
The module is segmented into discrete transducer devices that can be independently arranged and connected. Each transducer device is a separate functional unit with its own electrodes and active area, allowing flexible spatial arrangement and electrical interconnection through redistribution layers without requiring a monolithic thick structure
2Adaptability or versatility
If transducer devices are integrated in a module, then functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The module employs universal substrate and redistribution layer structures that can accommodate multiple types of transducer devices with different functions. The same basic manufacturing process and interconnection architecture support various transducer configurations, enabling enhanced functionality without proportionally increasing manufacturing complexity
Solution Approach 2:
Multiple transducer devices are merged into a single module package with shared substrate, protection layers, and interconnection structures. The redistribution layers serve multiple devices simultaneously, and the protection layer covers all devices in a unified manufacturing step, reducing overall manufacturing complexity despite enhanced functionality
Data Source
AI summary
A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.