Semiconductor Package Transparent Encapsulant for Proximity Sensing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In semiconductor device packages, the lid obstructs reflected beams when an object is close to the cover glass, preventing the proximity sensor from sensing the reflected light, due to its design that limits the incident angle of emitted beams.

Innovation Solution

A semiconductor device package design incorporating a carrier with an emitter and a first transparent encapsulant, where the encapsulant includes a body and a lens portion with specific surface orientations to allow the sensor to detect reflected light even when the object is close, by optimizing the angle and surface roughness of the encapsulant to ensure beam convergence and detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a lid is disposed above the emitter and sensor to limit the incident angle of beams, then crosstalk induced by the cover glass is avoided, but the reflected beams are blocked when the object is close to the cover glass

Engineering Contradiction:
Improvecrosstalk avoidanceVSAvoidproximity sensing accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The transparent encapsulant is divided into two functional portions: a lens portion for focusing emitted beams and a body portion with a planar surface for receiving reflected beams. This segmentation allows each portion to optimize its specific function, resolving the contradiction between limiting incident angles (for crosstalk avoidance) and allowing reflected beams to reach the sensor (for proximity sensing).

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The planar surface of the body portion acts as an intermediary between the lid and the sensor. It receives reflected beams that would otherwise be blocked by the lid's angle-limiting structure, and redirects them to the sensor. This intermediary surface enables the sensor to detect reflected beams from objects close to the cover glass while maintaining the lid's crosstalk prevention function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the lid blocks reflected beams to prevent crosstalk, then optical interference is reduced, but the sensor cannot sense reflected beams when the object is close

Engineering Contradiction:
Improveoptical interferenceVSAvoidsensor detection capability
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The transparent encapsulant is divided into two functional portions: a lens portion for focusing emitted beams and a body portion with a planar surface for receiving reflected beams. This segmentation allows each portion to optimize its specific function, resolving the contradiction between limiting incident angles (for crosstalk avoidance) and allowing reflected beams to reach the sensor (for proximity sensing).

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The planar surface of the body portion acts as an intermediary between the lid and the sensor. It receives reflected beams that would otherwise be blocked by the lid's angle-limiting structure, and redirects them to the sensor. This intermediary surface enables the sensor to detect reflected beams from objects close to the cover glass while maintaining the lid's crosstalk prevention function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enables the proximity sensor to effectively sense reflected light from objects close to the cover glass, improving the device's ability to determine distances and preventing unintended activation of touch screens in mobile devices.

Implementation Method 1

The first transparent encapsulant includes a body and a lens portion. The lens portion is disposed on the body and has a curved surface.

Methodology Applied
Scientific EffectLight refraction and focusing: Lens

Implementation Method 2

The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body... enabling the sensor to detect reflected light

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS10910532B2Semiconductor device package and method of manufacturing the same
Publication Date: 2021.02.02 ADVANCED SEMICON ENG INC
  • US10910532B2 patent drawing
  • US10910532B2 patent drawing
  • US10910532B2 patent drawing

AI summary

A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.