Semiconductor Package Structure With Trench-Sealed Copper Pillars
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Solution Overview
Problem
Existing semiconductor packaging technologies face issues with poor tightness and electrical insulation due to the small distance between pins and the substrate, leading to reduced device lifespan and increased risk of short circuits.
Innovation Solution
A semiconductor package structure featuring a package layer, a first device layer, a conductive copper pillar, and a second device layer, with a trench below the embedded device to allow complete filling of package material and enhance electrical insulation, including a first insulation layer made of Polypropylene or Aromatic Benzocyclobutene Film, and solder balls for external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance between pins of the device and the substrate is reduced to improve wiring density, then the wiring density is improved, but the tightness between the pins deteriorates and electrical insulation becomes poor
Solution Approach 1:
The patent introduces a trench structure that segments the packaging space into distinct regions. The trench divides the space between pins, creating separate compartments that prevent package material from bridging between adjacent pins. This segmentation allows pins to be placed closer together while maintaining electrical insulation and tightness, thus resolving the contradiction between wiring density and reliability.
2Productivity
If the distance between pins of the device and the substrate is reduced to improve wiring density, then the wiring density is improved, but electrical insulation between circuits deteriorates
Solution Approach 1:
The trench structure segments the packaging space to prevent electrical short circuits. By creating physical barriers between adjacent pins, the trench ensures that package material cannot create conductive paths between circuits, thereby maintaining electrical insulation even when pins are closely spaced for high wiring density.
Solution Approach 2:
The trench acts as an intermediary barrier between adjacent pins. This intermediate structure prevents direct contact between package material and multiple pins, serving as a mediator that maintains electrical insulation while allowing close pin spacing for improved wiring density.
3Reliability
If package material is used to fill the space between pins, then electrical insulation is improved, but the package material cannot completely fill the space when distance is very small, leading to poor tightness
Solution Approach 1:
The trench structure segments the packaging cavity into isolated compartments. This segmentation ensures that package material fills each compartment completely without bridging to adjacent pins, solving the problem of incomplete filling that occurs when pins are very close together. The trench acts as a barrier that defines clear fill boundaries for the molding process.
Data Source
AI summary
A semiconductor package structure and a manufacturing method therefor are disclosed. The semiconductor package structure includes a package layer, a first device layer, a first insulation layer, a conductive copper pillar, and a second device layer. The package layer covers the first device layer. The first device layer, the first insulation layer, and the second device layer are sequentially stacked. The conductive copper pillar extends through the first insulation layer. The first device layer and the second device layer are electrically connected through the conductive copper pillar. The first device layer includes a first circuit layer, a trench, and an embedded device. The embedded device is connected to the first circuit layer. The trench is arranged below the embedded device. The trench is partially or completely overlapped with a projection of the embedded device in a mounting direction of the embedded device.