Semiconductor Package Heat Transfer Member Trenches
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Solution Overview
Problem
Existing semiconductor package devices face challenges in achieving efficient heat release and maintaining signal transmission reliability due to interference between heat transfer members and via connection terminals in stacked package structures.
Innovation Solution
The semiconductor package device incorporates a heat transfer member between the lower and upper packages, with trenches in the molding compound layer to manage heat transfer efficiently and prevent interference with via connection terminals, using a conductive pad and uneven trench configurations to enhance heat dissipation and signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat transfer member is disposed between the lower and upper packages to improve heat release efficiency, then heat dissipation performance is improved, but the heat transfer member may flow into via connection terminals and interfere with signal transmission
Solution Approach 1:
The molding compound layer is segmented by forming first and second trenches that divide the space around the lower semiconductor chip. These trenches create separate regions that confine the heat transfer member and prevent it from reaching the via connection terminals, thus maintaining both heat dissipation effectiveness and signal transmission integrity.
Solution Approach 2:
The trenches act as intermediary barriers between the heat transfer member and the via connection terminals. By introducing this intermediate structure, the patent prevents direct contact or flow between the heat transfer member and the electrical connection paths, resolving the interference issue while preserving thermal management functionality.
2Temperature
If the molding compound layer is removed extensively to expose the lower package substrate for heat transfer, then heat transfer efficiency is improved, but the structural integrity and protection of underlying components is compromised
Solution Approach 1:
Instead of extensively removing the molding compound layer, the patent applies local quality by forming specific trenches only where needed for heat transfer. The molding compound is removed locally to create pathways for heat transfer while preserving the overall structural integrity and protective function of the molding compound layer in other regions.
3Volume of moving object
If via connection terminals are positioned closer to the lower semiconductor chip for compact design, then device miniaturization is achieved, but the risk of heat transfer member interference with signal transmission increases
Solution Approach 1:
The patent uses segmentation by forming trenches that create distinct zones within the molding compound layer. This segmentation allows via connection terminals to be positioned closer to the lower semiconductor chip for compact design while the trenches prevent heat transfer member flow into the terminal regions, maintaining signal transmission reliability despite the reduced spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat release efficiency and maintains reliable signal transmission between semiconductor chips by blocking heat transfer member flow into via connection terminals and providing a discharge passage, thereby enhancing the overall reliability and performance of the package on package (PoP) device.
Implementation Method 1
a heat transfer member disposed between a bottom surface of the upper package substrate and a top surface of the lower semiconductor chip
Data Source
AI summary
A semiconductor package device includes a lower package including a lower semiconductor chip mounted on the lower package substrate, a lower molding compound layer disposed on the lower package substrate, a first trench formed in the lower molding compound layer to surround the lower semiconductor chip, and a second trench connected to the first trench to extend to an outer wall of the lower package, the second trench being formed in the lower molding compound layer, an upper package disposed on the lower package. The upper package includes an upper package substrate and at least one upper semiconductor chip mounted on the upper package substrate and a heat transfer member disposed between the lower package and the upper package.